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Study On The Effect Of Additives In The Electrodeposition Of Sn-Ag-Cu Ternary Alloy Solder, Hua Miao, Ming-Rui Li, Wen-Zhong Zou, Guo-Yun Zhou, Shou-Xu Wang, Xiao-Jing Ye, Kai Zhu
Study On The Effect Of Additives In The Electrodeposition Of Sn-Ag-Cu Ternary Alloy Solder, Hua Miao, Ming-Rui Li, Wen-Zhong Zou, Guo-Yun Zhou, Shou-Xu Wang, Xiao-Jing Ye, Kai Zhu
Journal of Electrochemistry
Sn-Ag-Cu ternary alloy is the most ideal substitute for Sn-Pb alloy at present, and can be prepared by electrodeposition with high production efficiency, simple equipment, easy maintenance and excellent coating performance. The coordination system of the electroplating solution was investigated through the Hull cell experiment. The type of brighteners used in the plating solution and the ratio of the two brighteners were determined through the microscopic morphologic characterization, electrochemical corrosion test and cathodic polarization curve test. In addition, the dispersant and stabilizer were studied by observing the microscopic morphology and measuring the concentration change of Sn2+ ions in the plating …
Effect Of Chloride Ion On Electrochemical Behavior Of Silver Electrodeposition In Chcl-Urea Low Eutectic Solvent, Chong-Bo Zhan, Run-Jia Zhang, Xu Fu, Hai-Jing Sun, Xin Zhou, Bao-Jie Wang, Jie Sun
Effect Of Chloride Ion On Electrochemical Behavior Of Silver Electrodeposition In Chcl-Urea Low Eutectic Solvent, Chong-Bo Zhan, Run-Jia Zhang, Xu Fu, Hai-Jing Sun, Xin Zhou, Bao-Jie Wang, Jie Sun
Journal of Electrochemistry
Metallic silver coating has been widely used in the fields of microelectronics industry, catalyst, sensor and preparation of magnetoresistive materials because of its excellent corrosion resistance, good lubricity, high conductivity, excellent decoration and high catalysis. Compared with the traditional aqueous solution system, the research on metal electrodeposition in ionic liquid system is developing rapidly. In addition, additives are the key factors in the silver plating process. Adding a small amount of organic or inorganic additives to the plating solution will significantly change the coating properties, such as improving brightness, hardness and ductility. In this paper, using choline chloride urea (ChCl-Urea) …