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Advanced Thermosonic Wire Bonding Using High Frequency Ultrasonic Power: Optimization, Bondability, And Reliability, Minh-Nhat Ba Le
Advanced Thermosonic Wire Bonding Using High Frequency Ultrasonic Power: Optimization, Bondability, And Reliability, Minh-Nhat Ba Le
Master's Theses
Gold wire bonding typically uses 60 KHz ultrasonic frequency. Studies have been reported that increasing ultrasonic frequency from 60KHz to 120KHz can decrease bonding time, lower bonding temperature, and/or improve the bondability of Au metalized organic substrates. This thesis presents a systematic study of the effects of 120 KHz ultrasonic frequency on the reliability of fine pitch gold wire bonding. Two wire sizes, 25.4 and 17.8 μm in diameter (1.0 and 0.7 mil, respectively) were used. The gold wires were bonded to metalized pads over organic substrates with five different metallization. The studies were carried out using a thermosonic ball …