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Three Dimensional Magnetic Field Sensors And Array In Bicmos Technology, Bingda Wang

Theses

This thesis presents new designs of three dimensional magnetic field sensors in BiCMOS technology. The detailed design of the merged structure device by common diffusion and the high gain transduction circuit are presented. The merged structure has the advantage of less area, less external contacts and less parasitic capacitance. Cross-sensitivity is also eliminated by employing the merged structure. Three active on-chip loads are introduced to improve the sensitivity. The SPICE simulation results show that when a relative change in current ΔI/I is 0.001, about 13.6 mV and 8.5mV can be detected at the output in X(or Y) and Z directions, …