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Characterization And Quality Assessment Of Smart Polymer Systems Fabricated By Using 3d Printing Technique, Carlos Alejandro Garcia Rosales
Characterization And Quality Assessment Of Smart Polymer Systems Fabricated By Using 3d Printing Technique, Carlos Alejandro Garcia Rosales
Open Access Theses & Dissertations
Shape memory polymers (SMPs) are classified as smart materials due to their inherent stimulus-induced response. SMP is capable of recovering its original shape from a high degree of deformation by applying an external stimulus such as thermal energy. Other stimuli are electricity, light, chemical, and magnetic field. Shape memory polymers (SMPs) and its fabrication process has recently attracted much attention as a result of their potential application as soft active materials. Demonstration of SMP systems fabricated via 3D printing technologies has been one of the most popular attempts. This Dissertation presents an integration of two commercial SMP materials (DiAPLEX and …
Three-Dimensional Structural Electronic Integration For Small Satellite Fabrication, Cassie Gutierrez
Three-Dimensional Structural Electronic Integration For Small Satellite Fabrication, Cassie Gutierrez
Open Access Theses & Dissertations
The ability to realize truly three-dimensional electronic circuits is complicated if not impossible using traditional fabrication techniques. Such techniques are limited to the use of two dimensional printed circuit boards (PCBs), and require various dissonant processes which exhaust time, volume and cost. Due to the nature of Additive Manufacturing (AM) such problems are diminished and in some ways completely overcome. Additive Manufacturing allows for a higher range of design freedom along conformal surfaces, as well as unit level customization; it is the threshold for embedded electronics, allowing for three-dimensional circuitry in ways traditional fabrication is unfeasible. In such ways, additive …
Conformal Electronics Packaging Through Additive Manufacturing And Micro-Dispensing, Richard I. Olivas
Conformal Electronics Packaging Through Additive Manufacturing And Micro-Dispensing, Richard I. Olivas
Open Access Theses & Dissertations
Realizing electronic systems that are conformal with curved or complex surfaces is difficult if not impossible with conventional fabrication techniques, which require rigid, two dimensional, printed circuit boards (PCB). Flexible copper based fabrication is widely available commercially providing conformance, but not simultaneously stiffness. As a result, these systems are susceptible to reliability problems if repeatedly bent or stretched. The integration of Additive Manufacturing (AM) combined with Direct Print (DP) micro-dispensing can produce shapes of arbitrary and complex form that also allows for 1) miniature cavities for insetting electronic components and 2) conductive traces for electrical interconnect between components. The fabrication …