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An Experimental Procedure For Characterizing Interconnects To The Dc Power Bus On A Multilayer Printed Circuit Board, Hao Shi, James L. Drewniak, Todd H. Hubing, Thomas Van Doren, Fei Sha
An Experimental Procedure For Characterizing Interconnects To The Dc Power Bus On A Multilayer Printed Circuit Board, Hao Shi, James L. Drewniak, Todd H. Hubing, Thomas Van Doren, Fei Sha
Electrical and Computer Engineering Faculty Research & Creative Works
The effectiveness of dc power-bus decoupling is impacted by the inductance associated with interconnect vias in printed circuit boards (PCB's). Adequate characterization of these interconnects is necessary to facilitate modeling and simulation, and to assess the effectiveness of added decoupling. In this study, a measurement procedure is presented for determining the series inductance and resistance of an interconnect with a network analyzer. The validity and limitations of the procedure are discussed. Experimental results of interconnect parameters on an 8 × 10 in ten-layer test-board corroborate those measured with a precision impedance analyzer. The measured interconnect values are used to simulate …
An Expert System For Predicting Radiated Emi From Pcb's, Navin Kashyap, Todd H. Hubing, James L. Drewniak, Thomas Van Doren
An Expert System For Predicting Radiated Emi From Pcb's, Navin Kashyap, Todd H. Hubing, James L. Drewniak, Thomas Van Doren
Electrical and Computer Engineering Faculty Research & Creative Works
This paper describes an expert systems approach, based on symbolic reasoning techniques, to the problem of predicting radiated EMI levels from printed circuit boards. The expert system, currently under development at the University of Missouri-Rolla, USA, starts by extracting board geometry information from the board layout files. This information is fed into the classification algorithm, which determines the signal properties and nature of each net, using the knowledge stored in the knowledge base. The evaluation algorithm uses the available in formation to identify and evaluate critical circuit geometries, and then estimates the effect that these geometries have on system radiation …
Lumped-Element Sections For Modeling Coupling Between High-Speed Digital And I/O Lines, Wei Cui, Hao Shi, Xiao Luo, Fei Sha, James L. Drewniak, Thomas Van Doren, T. Anderson
Lumped-Element Sections For Modeling Coupling Between High-Speed Digital And I/O Lines, Wei Cui, Hao Shi, Xiao Luo, Fei Sha, James L. Drewniak, Thomas Van Doren, T. Anderson
Electrical and Computer Engineering Faculty Research & Creative Works
Lumped-element sections are used for modeling coupling between high-speed digital and I/O lines on printed circuit boards (PCBs) in this paper. Radiated electromagnetic interference (EMI) is investigated when the I/O line going off the board is driven as an unintentional, but effective antenna. Simulated results are compared with measurements for coupled lines. A suitable number of lumped-element sections for modeling is chosen based on the line length and the highest frequency of interest.