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Full-Text Articles in Engineering
Diagnosing And Modeling Common-Mode Radiation From Printed Circuit Boards With Attached Cables, James L. Drewniak, Fei Sha, Todd H. Hubing, Thomas Van Doren, J. Shaw
Diagnosing And Modeling Common-Mode Radiation From Printed Circuit Boards With Attached Cables, James L. Drewniak, Fei Sha, Todd H. Hubing, Thomas Van Doren, J. Shaw
Electrical and Computer Engineering Faculty Research & Creative Works
A procedure for diagnosing and modeling radiation from printed circuit boards with attached cables is presented through a case study of a production model electronic control unit. Procedures for determining EMI antennas, IC sources, and mechanisms by which noise is coupled from the IC source to the antenna are suggested.
Study Of Interconnect Vias By The Discrete Surface Integral Method, Hao Shi, James L. Drewniak
Study Of Interconnect Vias By The Discrete Surface Integral Method, Hao Shi, James L. Drewniak
Electrical and Computer Engineering Faculty Research & Creative Works
A non-orthogonal time-domain full-wave solver, is developed based on the Discrete Surface Integral (DSI) technique. Closed form expressions are derived for the coefficients used in the leap-frog computation scheme so that the DSI technique can be implemented as a generalized finite-difference procedure. This procedure is employed to investigate the propagation characteristics of a typical interconnect via in printed circuits. The numerically calculated scattering parameters show consistent behavior with measured results. A square via with equal area is also evaluated.
Power Bus Decoupling On Multilayer Printed Circuit Boards, Todd H. Hubing, James L. Drewniak, Thomas Van Doren, David M. Hockanson
Power Bus Decoupling On Multilayer Printed Circuit Boards, Todd H. Hubing, James L. Drewniak, Thomas Van Doren, David M. Hockanson
Electrical and Computer Engineering Faculty Research & Creative Works
Guidelines for the selection and placement of decoupling capacitors that work well for one-sided or two-sided printed circuit boards are not appropriate for multilayer boards with power and ground planes. Boards without internal planes take advantage of the power bus inductance to help decouple components at the higher frequencies. An effective decoupling strategy for multilayer boards must account for the low inductance and relatively high capacitance of the power bus.