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Full-Text Articles in Engineering
Advances In Autonomous-Underwater-Vehicle Based Passive Bottom-Loss Estimation By Processing Of Marine Ambient Noise, Lanfranco Muzi
Advances In Autonomous-Underwater-Vehicle Based Passive Bottom-Loss Estimation By Processing Of Marine Ambient Noise, Lanfranco Muzi
Dissertations and Theses
Accurate modeling of acoustic propagation in the ocean waveguide is important to SONAR-performance prediction, and requires, particularly in shallow water environments, characterizing the bottom reflection loss with a precision that databank-based modeling cannot achieve. Recent advances in the technology of autonomous underwater vehicles (AUV) make it possible to envision a survey system for seabed characterization composed of a short array mounted on a small AUV. The bottom power reflection coefficient (and the related reflection loss) can be estimated passively by beamforming the naturally occurring marine ambient-noise acoustic field recorded by a vertical line array of hydrophones. However, the reduced array …
Frame Synchronization Techniques For Inet-Formatted Soqpsk-Tg Communications, Andrew Dennis Mcmurdie
Frame Synchronization Techniques For Inet-Formatted Soqpsk-Tg Communications, Andrew Dennis Mcmurdie
Theses and Dissertations
In this thesis, frame synchronization for iNET formatted SOQPSK-TG communications is considered. Frame synchronization for M-ary linear modulations (MQAM, MPSK, etc.) are known in the literature using pilot detection methods, but are based on a signal model that does not apply to SOQPSK-TG. Maximum likelihood frame synchronizers are derived for an SOQPSK-TG system following assumptions found in the literature. The analysis shows that a reinterpretation of known detectors operating on the samples of the received waveform and locally stored samples of the pilot is the optimum approach for this case. Simulation results for an AWGN channel and several multipath channels …
High Frequency Signal Transmission In Through Silicon Via Based 3d Integrated Circuit, Min Xu
High Frequency Signal Transmission In Through Silicon Via Based 3d Integrated Circuit, Min Xu
Legacy Theses & Dissertations (2009 - 2024)
Through silicon vias (TSVs) enable 3-dimensional (3D) integrated circuits (ICs), which have the potential to reduce the power consumption, interconnect length and overall communication latency in modern nanoelectronics systems. High-speed signal transmission channels through stacked silicon substrates are critical for 3D heterogeneous integration. This work presents systematic analyses of fabricated 3D IC test structures. This includes test structure design, fabrication, experimental characterization, equivalent circuit modeling and full wave simulations for high-speed signal transmission of the TSV based 3D IC channels.