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Surface Micromachined Pressure Sensors, William P. Eaton Iv

Electrical and Computer Engineering ETDs

Surface micromachined pressure sensors were designed, modeled, fabricated, and tested. They employed a piezoresistive transduction mechanism and were based upon circular diaphragms, which vary from 50 to 1000 μm in diameter and 1 to 2 μm in thickness. The piezoresistors were placed in Wheatstone bridge configurations to provide simple signal amplification and first order temperature compensation.

Of the different micromachining techniques, surface-micromachining has the advantage of being the most similar to integrated circuit manufacturing. Hence an existing IC equipment set can be used to create mechanical structures. Furthermore, the monolithic integration of a mechanical device with control electronics is simpler …