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Full-Text Articles in Engineering
Design And Implementation Of Solid/Solid Phononic Crystal Structures In Lateral Extensional Thin-Film Piezoelectric On Silicon Micromechanical Resonators, Abdulrahman Alsolami
Design And Implementation Of Solid/Solid Phononic Crystal Structures In Lateral Extensional Thin-Film Piezoelectric On Silicon Micromechanical Resonators, Abdulrahman Alsolami
USF Tampa Graduate Theses and Dissertations
Achieving high quality factor in MEMS resonator devices is a critical demand for today’s wireless communication and sensing technologies. In order to reach this goal, several dedicated prior works have been conducted based on published literature at different frequency ranges. Particularly, piezoelectrically transduced resonators, which are widely deployed in commercial wireless communication systems, could benefit from greatly improved qualify factor. So far, their development has evolved from thin film bulk acoustic resonators (FBAR’s) using surface attached piezoelectric thin-film transducers with moderate Q factors to high Q resonators equipped with a side-supporting tether (anchor) attached vibrating resonators that allow the devices …
Hybrid Rf Acoustic Resonators And Arrays With Integrated Capacitive And Piezoelectric Transducers, Adnan Zaman
Hybrid Rf Acoustic Resonators And Arrays With Integrated Capacitive And Piezoelectric Transducers, Adnan Zaman
USF Tampa Graduate Theses and Dissertations
Over the past few decades, the usage of mobile communication devices such as smartphones, laptop computers, tablets has grown significantly. Clearly, smartphones and other mobile gadgets have been leading the current and emerging market thanks to the fast growing of wireless communications. Therefore, the wireless communications market is constantly looking for new ways to miniaturize the RF front-ends, while reducing the size, cost, and power consumption. Radio frequency microelectromechanical systems (RF MEMS) is widely viewed as a potential enabling technology for the multi-standard monolithic transceivers on a single chip with high reliability, high performance, and very low DC power consumption. …
Testing And Packaging For Mems Acoustic Emission Sensors, Ting-Hung Liu
Testing And Packaging For Mems Acoustic Emission Sensors, Ting-Hung Liu
USF Tampa Graduate Theses and Dissertations
The goal of this research is to improve the structure and dimension of the MEMS acoustic emission sensor. Acoustic emission sensor (AE sensor) based on the piezoelectric transducer is a well-developed technology in non-destructive testing that is widely used to determine permanent damage such as cracks and corrosions in buildings and structures. The AE sensor can be used to monitor cracks in structures and to check leakage in pressurized systems. The location of cracks in a structure or system leakage causes a high-frequency surface vibration while releasing ultrasonic energy. The frequency of this energy is typically between 30 kHz to …
Development Of 3-D Printed Hybrid Packaging For Gaas-Mems Oscillators Based On Piezoelectrically-Transduced Zno-On-Soi Micromechanical Resonators, Di Lan
USF Tampa Graduate Theses and Dissertations
Prior research focused on CMOS-MEMS integrated oscillator has been done using various foundry compatible integration techniques. In order to compensate the integration compatibility, MEMS resonators built on standard CMOS foundry process could not take full advantage of highest achievable quality factor on chip. System-in-package (SiP) and system-on-chip (SoC) is becoming the next generation of electronic packaging due to the need of multi-functional devices and multi-sensor systems, thus wafer level hybrid integration becomes the key to enable the full assembly of dissimilar devices. In this way, every active circuit and passive component can be individually optimized, so do the MEMS resonators …
Development Mems Acoustic Emission Sensors, Adrian Enrique Avila Gomez
Development Mems Acoustic Emission Sensors, Adrian Enrique Avila Gomez
USF Tampa Graduate Theses and Dissertations
The purpose of this research is to develop MEMS based acoustic emission sensors for structural health monitoring. Acoustic emission (AE) is a well-established nondestructive testing technique that is typically used to monitor for fatigue cracks in structures, leaks in pressurized systems, damages in composite materials or impacts. This technology can offer a precise evaluation of structural conditions and allow identification of imminent failures or minor failures that can be addressed by planned maintenances routines. AE causes a burst of ultrasonic energy that is measured as high frequency surface vibrations (30 kHz to 1 MHz) generated by transient elastic waves that …