Engineering Commons^™

Packaging Of Active Rf Beamforming Ic Utilizing Additive Manufacturing, Ryan Murphy

USF Tampa Graduate Theses and Dissertations

Packaging of an RF Beamforming IC was performed using an additive manufacturingplatform with FDM, microdispensing, laser subtractive manufacturing, and milling. The beamforming IC was embedded within a multilayer device structure in order to feed a 2x2 antenna sub-array in a compact and completely integrated package. Additive manufacturing allows for simple variation in material parameters and properties that enhances the ability to develop integrated system packaging. This study builds on previous investigations and demonstrates the ability to embed an active RF device with measurable gain within a printed plastic substrate. Critical to developing a repeatable method for this packaging solution, initial …

Additively Manufactured On-Package Multipolar Antenna Systems For Harsh Communication Channels, Ramiro A. Ramirez-Hernandez

USF Tampa Graduate Theses and Dissertations

Four main aspects are studied and explored throughout this dissertation: (1) On-Package Multipolar antenna system design for integration with commercial wireless sensor nodes for machine-to-machine communication applications; (2) Development of a novel MMIC packaging process and subsequent antenna integration for chip-to-chip communication applications, (3) Design and characterization of additively manufactured lumped passive elements for integration with MMIC and hybrid circuits, (4) Design and characterization of antennas for on- and off-metal radio frequency identification (RFID) applications.

This work presents the design of different 3-D printed tripolar antenna systems operating at 2.4 GHz. The antennas are designed for integration with commercial wireless …