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Thermal Analysis, Parasitic Extraction, And Wirebond Reliability Studies Of Power Electronic Modules, Shilpa Prabhudeva

Graduate Theses and Dissertations

This thesis research investigates thermal performance, parasitic extraction and wirebond/encapsulation reliability of power electronic modules. Thermal performance is critical to the power electronic modules. As such, thermal analysis is an important part of the power electronic module design process. Several cases are studied on generalized power modules with a full bridge layout. A database is built based on these results. The studies are performed using SolidWorks thermal simulation tool. The database involves several parameters such as power dissipation, maximum junction temperature, ambient temperature, convection coefficient required to cool the module, size of the baseplate, heat-sink size, substrate size, spacing between …