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Memristive Responses Of Jammed Granular Copper Array Sensors To Mechanical Stress, Gary A. Willey

Theses and Dissertations

A granular memristive device with the end goal of creating a novel system protection device is introduced in a 1-Dimension array. The electromechanical network will lay the groundwork for future 2-Dimensional and 3-Dimensional devices for simultaneous protection from intrusion. Off the shelf copper spheres with diameter of 710 ± 11microns were found through nano-indentation measurements to have elastic modulus of 106GPa, and compressive yield strength of 729MPa, these spheres were prepared for test in a 1-Dimensional array device. The arrays response to mechanical perturbations modeled by Hertz contact mechanics can be monitored by simultaneous electrical measurements across the multiple metal-insulator-metal …