Engineering Commons^™

Exploring Energy, Comfort, And Building Health Impacts Of Deep Setback And Normal Occupancy Smart Thermostat Implementation, Zachary Ethan Alderman

Graduate Theses and Dissertations

As smart thermostat adoption rates continue to increase, it becomes worthwhile to explore what unanticipated outcomes may result in their use. Specific attention was paid to smart thermostat impacts to deep setback and normal occupancy states in a variety of conditions while complying with the ventilation and temperature requirements of ASHRAE 90.2-2013. Custom weather models and occupancy schedules were generated to efficiently explore a combination of weather conditions, building constructions, and occupancy states. The custom modeling approach was combined with previous experimental data within the Openstudio graphics interface to the EnergyPlus building modeling engine. Results indicate smart thermostats add the …

3d Printed Pcu/Uhmwpe Polymeric Blends For Artificial Knee Meniscus, Raissa Araujo Borges

Graduate Theses and Dissertations

3D printing was used to fabricate porous artificial knee meniscus material from biocompatible polymeric blends of polycarbonate-urethane (PCU) and ultra-high-molecular-weight polyethylene (UHMWPE) to enable “weep” lubrication that mimics the native meniscus. 3D printed and molded pure PCU, as well as molded PCU and UHMWPE, were used for comparison. Preliminary printing was done to evaluate the impact of process parameters on the results. The samples were subject to a variety of rotational oscillating friction and wear tests under simulated body fluid and loading conditions to replicate the natural motion of the knee. Results show that 3D printed PCU samples yielded a …

Developing Methods Of Obtaining Quality Failure Information From Complex Systems, Oladapo Olalekan Bello

Graduate Theses and Dissertations

The complexity in most engineering systems is constantly growing due to ever-increasing technological advancements. This result in a corresponding need for methods that adequately account for the reliability of such systems based on failure information from components that make up these systems.

This dissertation presents an approach to validating qualitative function failure results from model abstraction details. The impact of the level of detail available to a system designer during conceptual stages of design is considered for failure space exploration in a complex system. Specifically, the study develops an efficient approach towards detailed function and behavior modeling required for complex …

Chip-Package Interfacial Stress Analysis And Reliability Implications For Flip-Chip Power Devices, Jonathan Gh Treco

Mechanical Engineering Undergraduate Honors Theses

The solder in flip-chip assemblies experience high stress and strain because of thermal mismatch induced deformation. These deformations occur because of the differences of coefficient of thermal expansion between flip-chip assembly materials. The similarly in stress profiles between thermal induced and shear induced stress in solder joints enable the use of die shear testing as a representative technique for relating the max stress the flip-chip can withstand to cyclic thermal fatigue failures. In this work, two electronic device sample preparation types are evaluated: One set of samples are soldered together and other set of samples use epoxy as an adhesive. …

System-Layout-Dependent Thermally Induced Solder Stress & Reliability Implications, Ange C. Iradukunda

Mechanical Engineering Undergraduate Honors Theses

Electronic flip chip assemblies consist of dissimilar component materials, which exhibit different CTE. Under thermal cyclic operating conditions, this CTE mismatch produces interfacial and interconnect stresses, which are highly dependent on system layout. In this paper, sensitivity analyses are performed using ANSYS FEA to establish how the proximity and arrangement of neighboring devices affect interconnect stress. Flip chip alignment modes ranging from edge-to-edge to corner-to-corner are studied. Results of these FEA studies, demonstrated that closely packing devices together has the effect of making them act as one. This results in a significant increase in the thermomechanical stresses induced on peripheral …