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Image Stitching And Matching Tool In The Automated Iterative Reverse Engineer (Aire) Integrated Circuit Analysis Suite, David C. Bowman

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Due to current market forces, leading-edge semiconductor fabrication plants have moved outside of the US. While this is not a problem at first glance, when it comes to security-sensitive applications, over-production, device cloning, or design alteration becomes a possibility. Since these vulnerabilities exist during the fabrication phase, a Reverse Engineering (RE) step must be introduced to help ensure secure device operation. This thesis proposes several unique methods and a collection of tools to ensure trust assurance in integrated circuit design by detecting fabrication flaws and possible hardware Trojans using several image processing techniques; fused into a singular view of the …