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Design, Extraction, And Optimization Tool Flows And Methodologies For Homogeneous And Heterogeneous Multi-Chip 2.5d Systems, Md Arafat Kabir
Design, Extraction, And Optimization Tool Flows And Methodologies For Homogeneous And Heterogeneous Multi-Chip 2.5d Systems, Md Arafat Kabir
Graduate Theses and Dissertations
Chip and packaging industries are making significant progress in 2.5D design as a result of increasing popularity of their application. In advanced high-density 2.5D packages, package redistribution layers become similar to chip Back-End-of-Line routing layers, and the gap between them scales down with pin density improvement. Chiplet-package interactions become significant and severely affect system performance and reliability. Moreover, 2.5D integration offers opportunities to apply novel design techniques. The traditional die-by-die design approach neither carefully considers these interactions nor fully exploits the cross-boundary design opportunities.
This thesis presents chiplet-package cross-boundary design, extraction, analysis, and optimization tool flows and methodologies for high-density …