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Articles 1 - 4 of 4
Full-Text Articles in Engineering
Copper Electrodeposition In Full Wafer Thickness Through-Silicon Vias, Rebecca P. Schmitt
Copper Electrodeposition In Full Wafer Thickness Through-Silicon Vias, Rebecca P. Schmitt
Chemical and Biological Engineering ETDs
Through-silicon vias (TSVs) are a key interconnect technology for advanced packaging of microelectronic devices, and full wafer thickness TSVs are required for certain microelectromechanical systems (MEMS) applications. In this work, electrolytes containing copper sulfate, an acid, chloride, and Tetronic 701 suppressor were implemented for Cu filling of high aspect ratio (10:1), full wafer thickness TSVs. For each electrolyte system, rotating disk electrode voltammetry was used to identify a voltage range for bottom-up Cu filling in the TSVs. Die level feature filling was performed using voltage ramping, which moved active deposition through the vias to yield void-free Cu features. During voltage-controlled …
Understanding The Role Of Atom Trapping In The Evolution Of Hydrocarbon Transformation Catalyst Morphology, Griffin Canning
Understanding The Role Of Atom Trapping In The Evolution Of Hydrocarbon Transformation Catalyst Morphology, Griffin Canning
Chemistry and Chemical Biology ETDs
Converting alkanes to other, more chemically and economically valuable molecules requires catalysts that can survive elevated temperatures and highly reducing environments. These environments can cause many metal-nanoparticle based catalysts to sinter rapidly, causing a loss of activity. They must also tolerate the coke formation, as well, since coke can restrict access to active sites by gas phase molecules, thus lowering catalytic activity. While there are routes to improve both the sinter and coke resistance of catalysts, an alternative strategy is to develop a protocol for regenerating the activity of the catalyst in question when coke formation or sintering becomes problematic. …
Atom Trapping And Its Role On The Nucleation & Growth Of Platinum Nanoparticles, Deepak Kunwar
Atom Trapping And Its Role On The Nucleation & Growth Of Platinum Nanoparticles, Deepak Kunwar
Chemistry and Chemical Biology ETDs
Diesel oxidation catalysts deactivate due to Pt sintering, a major problem in automotive industries. To make sure they operate effectively throughout the lifetime of the vehicle, automotive industries are putting an excessive amount of Pt. There is a need to develop a catalyst that serves long term performance with minimal use of Pt. Jones et al.1 demonstrated that ceria traps Pt atoms. His work generated some logical and valid questions such as what is the mechanism for the formation of anomalously large Pt particles? What is the upper limit of Pt metal loading in the form of single atoms …
Synthesis, Self-Assembly And High-Pressure Properties Of Nanoparticles And Hybrid Nanocomposites, Lingyao Meng
Synthesis, Self-Assembly And High-Pressure Properties Of Nanoparticles And Hybrid Nanocomposites, Lingyao Meng
Nanoscience and Microsystems ETDs
Nanoparticles have gained significant scientific interests owing to their unique structural dimensions, size- and shape-tunable properties, and numerous fascinating applications, from opto-electronics, sensor devices, to energy, environmental, and medical fields. Furthermore, the synergistic integration of other materials, including organic polymers, with nanoparticles provides new opportunities and strategies to obtain nanocomposites with superior properties and functionalities. While there is already significant research on the synthesis and characterizations of nanoparticles and hybrid nanocomposites, some research questions, such as how to design and control the interfacial morphology in polymer/nanoparticle hybrid nanocomposites, how to synthesize metal- organic framework (MOF) nanoparticles in well-defined and uniform …