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Chemical Engineering

University of Nebraska - Lincoln

Department of Chemical and Biomolecular Engineering: Patents

2000

Conductive filler

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Composition Containing A Polymer And Conductive Filler And Use Thereof, Ravi F. Saraf Jan 2000

Composition Containing A Polymer And Conductive Filler And Use Thereof, Ravi F. Saraf

Department of Chemical and Biomolecular Engineering: Patents

A composition containing a polymeric matrix and a conductive filler component is provided. The conductive filler component comprises conductive particles and a polymer selected from the group consisting of substituted and unsubstituted polyanilines, substituted and unsubstituted polyparaphenylenevinylenes, substituted and unsubstituted polythiophenes, substituted and unsubstituted polyazines, substituted and unsubstituted polyparaphenylenes, substituted and unsubstituted polyfuranes, substituted and unsubstituted polypyrroles, substituted and unsubstituted polyselenophene, substituted and unsubstituted poly-p-phenylene sulfides and substituted and unsubstituted polyacetylenes, and mixtures thereof, and copolymers thereof. Compositions of the present invention are useful as corrosion protecting layers for metal substrates, for electrostatic discharge protection, electromagnetic interference shielding, and as …