Open Access. Powered by Scholars. Published by Universities.®

Engineering Commons

Open Access. Powered by Scholars. Published by Universities.®

Automotive Engineering

Clemson University

Curing

Publication Year

Articles 1 - 3 of 3

Full-Text Articles in Engineering

Numerical Implementation And Validation Of A Viscoelastic-Plastic Material Model For Predicting Curing Induced Residual Stresses In Adhesive Bonded Joints, Akshat Agha, Fadi Abu-Farha Jun 2022

Numerical Implementation And Validation Of A Viscoelastic-Plastic Material Model For Predicting Curing Induced Residual Stresses In Adhesive Bonded Joints, Akshat Agha, Fadi Abu-Farha

Publications

One of the main challenges in the joining of multi-material components is the assessment of the nature and magnitude of the residual stresses developing in the adhesive bond during the heat curing manufacturing process. Numerical modeling of these residual stresses can provide insights for making informed decisions related to (i) material substrate properties; (ii) adhesive properties i.e., low, medium, or high stiffness; (iii) bondline geometry i.e., bondline width and bead thickness; (iv) curing cycle characteristics; and (v) fixation design i.e., type, spacing, the number of joints. This work presents a cure history-dependent viscoelastic-plastic material description for the modeling of adhesive …


Viscoelastic Model To Capture Residual Stresses In Heat Cured Dissimilar Adhesive Bonded Joints, Akshat Agha, Fadi Abu-Farha Jun 2021

Viscoelastic Model To Capture Residual Stresses In Heat Cured Dissimilar Adhesive Bonded Joints, Akshat Agha, Fadi Abu-Farha

Publications

The thermal loading during the curing process of an adhesive-bonded joint induces residual stresses in the joint, thereby affecting its performance. The problem becomes worse in the case of a multi-material joint involving varying coefficients of thermal expansion (CTE) for different parts. A novel approach was developed to model the properties of automotive grade structural adhesives during the heat curing process. The material model was divided into two components: curing kinetics model and viscoelastic mechanical model. The models were calibrated using experimental data from Differential Scanning Calorimetry (DSC) and Dynamic Mechanical Analysis (DMA) tests performed on an epoxy-based single-component adhesive. …


Experimental Methods To Capture Curing Induced Effects In Adhesive Bonded Joints, Akshat Agha, Fadi Abu-Farha Jan 2021

Experimental Methods To Capture Curing Induced Effects In Adhesive Bonded Joints, Akshat Agha, Fadi Abu-Farha

Publications

The rapidly increasing use of structural adhesives, especially in the joining of automotive body structures has motivated various investigations of the effects of adhesive curing process on joints. The automotive-grade structural adhesives require heat curing, which, in the meantime, performs thermal loading on the substrates and causes undesirable effects in the joint. For example, the curing process results in complex residual stresses in the adhesive bond which are detrimental to the performance of the adhesive bond and thereby the automobile body structure, particularly the crashworthiness. To thoroughly evaluate such effects, this paper consists of two parts. The first part presents …