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Viscoelastic Model To Capture Residual Stresses In Heat Cured Dissimilar Adhesive Bonded Joints, Akshat Agha, Fadi Abu-Farha
Viscoelastic Model To Capture Residual Stresses In Heat Cured Dissimilar Adhesive Bonded Joints, Akshat Agha, Fadi Abu-Farha
Publications
The thermal loading during the curing process of an adhesive-bonded joint induces residual stresses in the joint, thereby affecting its performance. The problem becomes worse in the case of a multi-material joint involving varying coefficients of thermal expansion (CTE) for different parts. A novel approach was developed to model the properties of automotive grade structural adhesives during the heat curing process. The material model was divided into two components: curing kinetics model and viscoelastic mechanical model. The models were calibrated using experimental data from Differential Scanning Calorimetry (DSC) and Dynamic Mechanical Analysis (DMA) tests performed on an epoxy-based single-component adhesive. …
Experimental Methods To Capture Curing Induced Effects In Adhesive Bonded Joints, Akshat Agha, Fadi Abu-Farha
Experimental Methods To Capture Curing Induced Effects In Adhesive Bonded Joints, Akshat Agha, Fadi Abu-Farha
Publications
The rapidly increasing use of structural adhesives, especially in the joining of automotive body structures has motivated various investigations of the effects of adhesive curing process on joints. The automotive-grade structural adhesives require heat curing, which, in the meantime, performs thermal loading on the substrates and causes undesirable effects in the joint. For example, the curing process results in complex residual stresses in the adhesive bond which are detrimental to the performance of the adhesive bond and thereby the automobile body structure, particularly the crashworthiness. To thoroughly evaluate such effects, this paper consists of two parts. The first part presents …