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Full-Text Articles in Engineering
Flip-Chip (Fc) And Fine-Pitch-Ball-Grid-Array (Fpbga) Underfills For Application In Aerospace Electronics—Brief Review, Ephraim Suhir, Reza Ghaffarian
Flip-Chip (Fc) And Fine-Pitch-Ball-Grid-Array (Fpbga) Underfills For Application In Aerospace Electronics—Brief Review, Ephraim Suhir, Reza Ghaffarian
Mechanical and Materials Engineering Faculty Publications and Presentations
In this review, some major aspects of the current underfill technologies for flip-chip (FC) and fine-pitch-ball-grid-array (FPBGA), including chip-size packaging (CSP), are addressed, with an emphasis on applications, such as aerospace electronics, for which high reliability level is imperative. The following aspects of the FC and FPGGA technologies are considered: attributes of the FC and FPBGA structures and technologies; underfill-induced stresses; the roles of the glass transition temperature (Tg) of the underfill materials; some major attributes of the lead-free solder systems with underfill; reliability-related issues; thermal fatigue of the underfilled solder joints; warpage-related issues; attributes of accelerated life …
Thermally Stable Super-Hydrophobic Surface Creation, Caleb Turner
Thermally Stable Super-Hydrophobic Surface Creation, Caleb Turner
Undergraduate Research & Mentoring Program
Thermally stable super-hydrophobic surface coatings are critical to applications in low gravity fluid dynamics, and in particular Leidenfrost effects. The challenges of manufacturing different super-hydrophobic coatings that are thermally stable, semi-transparent, and environmentally safe at desired operating temperatures is pursued in order to explore the applications of such coatings aboard spacecraft. A catalog of surface coating manufacturing procedures is tabulated with measures for static contact angle, thermal stability, and transparency. These quantities and methods serve as a foundation for both technology applications and follow on experimentation concerning low gravity fluid mechanics at the Portland State Dryden Drop Tower lab.
Aerospace Mission Outcome: Predictive Modeling, Ephraim Suhir
Aerospace Mission Outcome: Predictive Modeling, Ephraim Suhir
Mechanical and Materials Engineering Faculty Publications and Presentations
Human-in-the-Loop (HITL)-related models can be applied in various aerospace vehicular problems, when human qualifications and performance are crucial and the ability to quantify them is therefore imperative; since nobody is perfect, these evaluations should preferably be done on a probabilistic basis. The suggested models can also be used in many other areas of applied science and engineering, not even necessarily vehicular engineering, when a human encounters an extraordinary situation and should possess a sufficiently high human capacity factor (HCF) to successfully cope with an elevated mental workload (MWL). The incentive for probabilistic predictive modeling and the rationale for such modeling …