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Missouri University of Science and Technology

2006

Coupling

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Application Of Chip-Level Emc In Automotive Product Design, Kuifeng Hu, H. Weng, Daryl G. Beetner, David Pommerenke, James L. Drewniak, K. Lavery, Jason Whiles Aug 2006

Application Of Chip-Level Emc In Automotive Product Design, Kuifeng Hu, H. Weng, Daryl G. Beetner, David Pommerenke, James L. Drewniak, K. Lavery, Jason Whiles

Electrical and Computer Engineering Faculty Research & Creative Works

Integrated circuits (ICs) are often the source of the high-frequency noise that drives electromagnetic emissions from electronic products. A case study is presented where emissions from a printed circuit board containing an automotive microcontroller are reduced significantly through analysis of the coupling mechanisms from the chip to the board and attached cables. Noise generated by the IC is explored through measurements in a semi-anechoic chamber and TEM cell, through near-field scans, and through modifications to the printed circuit board. Noise is driven by the IC through both power and I/O connections. Results show that a ferrite in series with I/O …