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Quantitative Understanding Of Nanoparticle Flocculation In Water Treatment, Sungmin Youn Mar 2018

Quantitative Understanding Of Nanoparticle Flocculation In Water Treatment, Sungmin Youn

Sungmin Youn

Flocculation is critical in drinking water treatment; in flocculation, the particle size distribution changes from a large number of small particles to a small number of larger particles. Larger particles are effectively removed by settling and filtration processes that follow flocculation. In recent years, manufacturing of engineered nanoparticles has skyrocketed, and these nanoparticles can enter our water supplies, but knowledge of their fate in water treatment is limited. The objective of this research was to update knowledge of flocculation by extending previous work at the microscale to the nanoscale.

Flocculation involves transport of particles to the vicinity of one another ...


Surface States In Template Synthesized Tin Oxide Nanoparticles, A. Cabot, J. Arbiol, R. Ferre, J. R. Morante, Fanglin Chen, Meilin Liu Mar 2015

Surface States In Template Synthesized Tin Oxide Nanoparticles, A. Cabot, J. Arbiol, R. Ferre, J. R. Morante, Fanglin Chen, Meilin Liu

Fanglin Chen

Tin–oxide nanoparticles with controlled narrow size distributions are synthesized while physically encapsulated inside silica mesoporous templates. By means of ultraviolet-visible spectroscopy, a redshift of the optical absorbance edge is observed. Photoluminescence measurements corroborate the existence of an optical transition at 3.2 eV. The associated band of states in the semiconductor gap is present even on template-synthesized nanopowders calcined at 800 °C, which contrasts with the evolution of the gap states measured on materials obtained by other methods. The gap states are thus considered to be surface localized, disappearing with surface faceting or being hidden by the surface-to-bulk ratio ...


Effect Of Molybdenum Disulfide Particle Sizes On Wear Performance Of Commercial Lubricant, Innovative Research Publications Irp India, S. M. Muzakkir, Harish Hirani Mar 2015

Effect Of Molybdenum Disulfide Particle Sizes On Wear Performance Of Commercial Lubricant, Innovative Research Publications Irp India, S. M. Muzakkir, Harish Hirani

Innovative Research Publications IRP India

Experimental investigations have been conducted for determination of effectiveness of employing a combination of three particle sizes (40 nm size, 1.75 μm size and 53 μm size) of Molybdenum Disulphide as anti-wear additive in a commercial lubricant. The conformal block and disk configuration has been used to conduct experiments for determination of wear of the sliding surfaces. The performance of the proposed combined particle sizes anti-wear additive is compared with single particle size anti-wear additives to establish its robustness under varying surface conditions.


Eulerian-Lagrangian Analysis Of Solid Particle Distribution In An Internally Heated And Cooled Air-Filled Cavity Jan 2015

Eulerian-Lagrangian Analysis Of Solid Particle Distribution In An Internally Heated And Cooled Air-Filled Cavity

Faculty of Engineering University of Malaya

A parametric study has been conducted to investigate particle deposition on solid surfaces during free convection flow in an internally heated and cooled square cavity filled with air. The cavity walls are insulated while several pairs of heaters and coolers (HACs) inside the cavity lead to free convection flow. The HACs are assumed to be isothermal heat source and sinks with temperatures T-h and T-c (T-h > T-c). The problem is numerically investigated using the Eulerian-Lagrangian method. Two-dimensional Navier-Stokes and energy equations are solved using finite volume discretization method. Applying the Lagrangian approach, 5000 particles, distributed randomly in the enclosure, were ...


Probing The Enzymatic Activity Of Alkaline Phosphatase Within Quantum Dot Bioconjugates, Jonathan C. Claussen, Anthony Malanoski, Joyce C. Breger, Eunkeu Oh, Scott A. Walper, Kimihiro Susumu, Ramasis Goswami, Jeffrey R. Deschamps, Igor L. Medintz Jan 2015

Probing The Enzymatic Activity Of Alkaline Phosphatase Within Quantum Dot Bioconjugates, Jonathan C. Claussen, Anthony Malanoski, Joyce C. Breger, Eunkeu Oh, Scott A. Walper, Kimihiro Susumu, Ramasis Goswami, Jeffrey R. Deschamps, Igor L. Medintz

Jonathan C. Claussen

Enzymes provide the critical means by which to catalyze almost all biological reactions in a controlled manner. Methods to harness and exploit their properties are of strong current interest to the growing field of biotechnology. In contrast to depending upon recombinant genetic approaches, a growing body of evidence suggests that apparent enzymatic activity can be enhanced when located at a nanoparticle interface. We use semiconductor quantum dots (QDs) as a well-defined and easily bioconjugated nanoparticle along with Escherichia coli-derived alkaline phosphatase (AP) as a prototypical enzyme to seek evidence for this process in a de novo model system. We began ...


Nanomaterial-Mediated Biosensors For Monitoring Glucose, Eric S. Mclamore, Masashige Taguchi, Andre Ptitsyn, Jonathan C. Claussen Jan 2014

Nanomaterial-Mediated Biosensors For Monitoring Glucose, Eric S. Mclamore, Masashige Taguchi, Andre Ptitsyn, Jonathan C. Claussen

Jonathan C. Claussen

Real-time monitoring of physiological glucose transport is crucial for gaining new understanding of diabetes. Many techniques and equipment currently exist for measuring glucose, but these techniques are limited by complexity of the measurement, requirement of bulky equipment, and low temporal/spatial resolution. The development of various types of biosensors (eg, electrochemical, optical sensors) for laboratory and/or clinical applications will provide new insights into the cause(s) and possible treatments of diabetes. State-of-the-art biosensors are improved by incorporating catalytic nanomaterials such as carbon nanotubes, graphene, electrospun nanofibers, and quantum dots. These nanomaterials greatly enhance biosensor performance, namely sensitivity, response time ...


Influence Of Ni Nanoparticle On The Morphology And Growth Of Interfacial Intermetallic Compounds Between Sn-3.8ag-0.7cu Lead-Free Solder And Copper Substrate Feb 2013

Influence Of Ni Nanoparticle On The Morphology And Growth Of Interfacial Intermetallic Compounds Between Sn-3.8ag-0.7cu Lead-Free Solder And Copper Substrate

A.S. Md Abdul Haseeb

This paper reports on the effects of adding Ni nanoparticles to a Sn-3.8Ag-0.7Cu solder. The nanocomposite was prepared by manual blending of SAC solder paste with various percentages of Ni particles. Results showed that the addition of Ni nanoparticles did not bring any significant change in the onset melting temperature of the solder. An increase in the weight percentage of nanoparticles in the solder caused an increase of the wetting angle and a decrease of spreading rate. Moreover, the addition of Ni nanoparticles changed the interfacial intermetallic compound morphology from a scalloped structure into a planar type structure ...


Effects Of Reflow On The Interfacial Characteristics Between Zn Nanoparticles Containing Sn-3.8ag-0.7cu Solder And Copper Substrate Jan 2013

Effects Of Reflow On The Interfacial Characteristics Between Zn Nanoparticles Containing Sn-3.8ag-0.7cu Solder And Copper Substrate

A.S. Md Abdul Haseeb

Purpose - The purpose of this paper is to investigate the effects of zinc (Zn) nanoparticles on the interfacial intermetallic compounds (IMCs) between Sn-3.8Ag-0.7Cu (SAC) solder and Cu substrate during multiple reflow. Design/methodology/approach - The nanocomposite solders were prepared by manually mixing of SAC solder paste with varying amounts of Zn nanoparticles. The solder pastes were reflowed on a hotplate at 250 C for 45 s for up to six times. The actual Zn content after reflow was analyzed by inductively coupled plasma-optical emission spectroscopy (ICP-OES). The wetting behavior of the solders was characterized by analyzing the contact ...


Effects Of Reflow On The Interfacial Characteristics Between Zn Nanoparticles Containing Sn-3.8ag-0.7cu Solder And Copper Substrate Jan 2013

Effects Of Reflow On The Interfacial Characteristics Between Zn Nanoparticles Containing Sn-3.8ag-0.7cu Solder And Copper Substrate

A.S. Md Abdul Haseeb

Purpose - The purpose of this paper is to investigate the effects of zinc (Zn) nanoparticles on the interfacial intermetallic compounds (IMCs) between Sn-3.8Ag-0.7Cu (SAC) solder and Cu substrate during multiple reflow. Design/methodology/approach - The nanocomposite solders were prepared by manually mixing of SAC solder paste with varying amounts of Zn nanoparticles. The solder pastes were reflowed on a hotplate at 250 C for 45 s for up to six times. The actual Zn content after reflow was analyzed by inductively coupled plasma-optical emission spectroscopy (ICP-OES). The wetting behavior of the solders was characterized by analyzing the contact ...


Effects Of Reflow On The Interfacial Characteristics Between Zn Nanoparticles Containing Sn-3.8ag-0.7cu Solder And Copper Substrate Jan 2013

Effects Of Reflow On The Interfacial Characteristics Between Zn Nanoparticles Containing Sn-3.8ag-0.7cu Solder And Copper Substrate

A.S. Md Abdul Haseeb

Purpose - The purpose of this paper is to investigate the effects of zinc (Zn) nanoparticles on the interfacial intermetallic compounds (IMCs) between Sn-3.8Ag-0.7Cu (SAC) solder and Cu substrate during multiple reflow. Design/methodology/approach - The nanocomposite solders were prepared by manually mixing of SAC solder paste with varying amounts of Zn nanoparticles. The solder pastes were reflowed on a hotplate at 250 C for 45 s for up to six times. The actual Zn content after reflow was analyzed by inductively coupled plasma-optical emission spectroscopy (ICP-OES). The wetting behavior of the solders was characterized by analyzing the contact ...


Preparation And Low-Temperature Sintering Of Cu Nanoparticles For High-Power Devices Apr 2012

Preparation And Low-Temperature Sintering Of Cu Nanoparticles For High-Power Devices

A.S. Md Abdul Haseeb

One of the fundamental requirements for high-temperature electronic packaging is reliable silicon attach with low and stable electrical resistance. This paper presents a study conducted on Cu nanoparticles as an alternative lead-free interconnect material for high-temperature applications. Cu nanoparticles were prepared using pulsed wire evaporation technique in water medium. Pure Cu nanoparticles without any organic mixture were used in this paper. An economical approach to extract the nanoparticles from water was established. In situ Cu nanoparticles oxide reduction was successfully done using forming gas $({\rm N}-{2}{\hbox{-}}5\%{\rm H}-{2})$. Cross-section analysis on bonded interface shows onset of ...


Stability Of Molybdenum Nanoparticles In Sn-3.8ag-0.7cu Solder During Multiple Reflow And Their Influence On Interfacial Intermetallic Compounds Feb 2012

Stability Of Molybdenum Nanoparticles In Sn-3.8ag-0.7cu Solder During Multiple Reflow And Their Influence On Interfacial Intermetallic Compounds

A.S. Md Abdul Haseeb

This work investigates the effects of molybdenum nanoparticles on the growth of interfacial intermetallic compound between Sn-3.8Ag-0.7Cu solder and copper substrate during multiple reflow. Molybdenum nanoparticles were mixed with Sn-3.8Ag-0.7Cu solder paste by manual mixing. Solder samples were reflowed on a copper substrate in a 250 °C reflow oven up to six times. The molybdenum content of the bulk solder was determined by inductive coupled plasma-optical emission spectrometry. It is found that upon the addition of molybdenum nanoparticles to Sn-3.8Ag-0.7Cu solder, the interfacial intermetallic compound thickness and scallop diameter decreases under all reflow conditions ...


Effects Of Addition Of Copper Particles Of Different Size To Sn-3.5ag Solder Dec 2011

Effects Of Addition Of Copper Particles Of Different Size To Sn-3.5ag Solder

A.S. Md Abdul Haseeb

No abstract provided.


A Benchmark Study On The Thermal Conductivity Of Nanofluids, Jacopo Buongiorno, David C. Venerus, Naveen Prabhat, Thomas Mckrell, Jessica Townsend, Rebecca J. Christianson, Yuriv V. Tolmachev, Pawel Keblinski, Lin-Wen Hu, Jorge L. Alvarado, In Cheol Bang, Sandra W. Bishnoi, Marco Bonetti, Frank Botz, Anselmo Cecere, Yun Chang, Gang Chen, Haisheng Chen, Sung Jae Chung, Minking K. Chyu, Sarit K. Das, Roberto Di Paola, Yulong Ding, Frank Dubois, Grzegorz Dzido, Jacob Eapen, Werner Escher, Denis Funfschilling, Quentin Galand, Jinwei Gao, Patricia E. Gharagozloo, Kenneth E. Goodson, Jorge Gustavo Gutierrez, Haiping Hong, Mark Horton, Kyo Sik Hwang, Carlo S. Iorio, Seok Pil Jang, Andrzej B. Jarzebski, Yiran Jiang, Stephan Kabelac, Liwen Jin, Aravind Kamath, Mark A. Kedzierski, Lim Geok Kieng, Chongyoup Kim, Ji-Hyun Kim, Seokwon Kim, Seung Hyun Lee, Kai Choong Leong, Indranil Manna, Bruno Michel, Rui Ni, Hrishikesh E. Patel, John Philip, Dimos Poulikakos, Cecil Reynaud, Raffaele Savino, Pawan K. Singh, Pengxiang Song, Thirumalachari Sundararajan, Elena Timofeeva, Todd Tritcak, Aleksandr N. Turanov, Stefan Van Vaerenbergh, Dongsheng Wen, Sanjeeva Witharana, Chun Yang, Wei-Hsun Yeh, Xiao-Zheng Zhao, Sheng-Qi Zhou Dec 2011

A Benchmark Study On The Thermal Conductivity Of Nanofluids, Jacopo Buongiorno, David C. Venerus, Naveen Prabhat, Thomas Mckrell, Jessica Townsend, Rebecca J. Christianson, Yuriv V. Tolmachev, Pawel Keblinski, Lin-Wen Hu, Jorge L. Alvarado, In Cheol Bang, Sandra W. Bishnoi, Marco Bonetti, Frank Botz, Anselmo Cecere, Yun Chang, Gang Chen, Haisheng Chen, Sung Jae Chung, Minking K. Chyu, Sarit K. Das, Roberto Di Paola, Yulong Ding, Frank Dubois, Grzegorz Dzido, Jacob Eapen, Werner Escher, Denis Funfschilling, Quentin Galand, Jinwei Gao, Patricia E. Gharagozloo, Kenneth E. Goodson, Jorge Gustavo Gutierrez, Haiping Hong, Mark Horton, Kyo Sik Hwang, Carlo S. Iorio, Seok Pil Jang, Andrzej B. Jarzebski, Yiran Jiang, Stephan Kabelac, Liwen Jin, Aravind Kamath, Mark A. Kedzierski, Lim Geok Kieng, Chongyoup Kim, Ji-Hyun Kim, Seokwon Kim, Seung Hyun Lee, Kai Choong Leong, Indranil Manna, Bruno Michel, Rui Ni, Hrishikesh E. Patel, John Philip, Dimos Poulikakos, Cecil Reynaud, Raffaele Savino, Pawan K. Singh, Pengxiang Song, Thirumalachari Sundararajan, Elena Timofeeva, Todd Tritcak, Aleksandr N. Turanov, Stefan Van Vaerenbergh, Dongsheng Wen, Sanjeeva Witharana, Chun Yang, Wei-Hsun Yeh, Xiao-Zheng Zhao, Sheng-Qi Zhou

Jessica Townsend

This article reports on the International Nanofluid Property Benchmark Exercise, or INPBE, in which the thermal conductivity of identical samples of colloidally stable dispersions of nanoparticles or “nanofluids,” was measured by over 30 organizations worldwide, using a variety of experimental approaches, including the transient hot wire method, steady-state methods, and optical methods. The nanofluids tested in the exercise were comprised of aqueous and nonaqueous basefluids, metal and metal oxide particles, near-spherical and elongated particles, at low and high particle concentrations. The data analysis reveals that the data from most organizations lie within a relatively narrow band (±10% or less) about ...


Effects Of Co Nanoparticle Addition To Sn-3.8ag-0.7cu Solder On Interfacial Structure After Reflow And Ageing May 2011

Effects Of Co Nanoparticle Addition To Sn-3.8ag-0.7cu Solder On Interfacial Structure After Reflow And Ageing

A.S. Md Abdul Haseeb

Effects of Co nanoparticle additions to Sn-3.8Ag-0.7Cu on the structure of solder/copper interface have been studied after reflow and high temperature ageing (150 °C, up to 1008 h). Results show that the Co nanoparticles substantially suppress the growth of Cu3Sn but enhance Cu 6Sn5 growth. Cobalt nanoparticles reduce interdiffusion coefficient in Cu3Sn. It is suggested that the Co nanoparticles undergo surface dissolution during reflow and exert their influence, at least partially, through alloying effect. © 2011 Elsevier Ltd. All rights reserved.


Addition Of Cobalt Nanoparticles Into Sn-3.8ag-0.7cu Lead-Free Solder By Paste Mixing Jan 2011

Addition Of Cobalt Nanoparticles Into Sn-3.8ag-0.7cu Lead-Free Solder By Paste Mixing

A.S. Md Abdul Haseeb

Purpose - The purpose of this paper is to investigate the effects of addition Co nanoparticles on the characteristic properties of Sn-3.8Ag-0.7Cu solder. Design/methodology/approach - Cobalt (Co) nanoparticles were added to Sn-Ag-Cu solders by thoroughly blending various weight percentages (0-2.0 wt%) of Co nanoparticles with near eutectic SAC387 solder paste. Blending was done mechanically for 30 min to ensure a homogeneous mixture. The paste mixture was then reflowed on a hot plate at 250°C for 45 s. The melting points of nanocomposite solder were determined by differential scanning calorimetry. Spreading rate of nanocomposite was calculated following ...


Interfacial Reaction And Dissolution Behavior Of Cu Substrate In Molten Sn-3.8ag-0.7cu In The Presence Of Mo Nanoparticles Jan 2011

Interfacial Reaction And Dissolution Behavior Of Cu Substrate In Molten Sn-3.8ag-0.7cu In The Presence Of Mo Nanoparticles

A.S. Md Abdul Haseeb

Purpose - In electronic packaging, when solid copper comes in contact with liquid solder alloy, the former dissolves and intermetallic compounds (IMCs) form at the solid-liquid interface. The purpose of this paper is to study the effect of the presence of molybdenum nanoparticles on the dissolution of copper and the formation of interfacial IMC. Design/methodology/approach - Cu wire having a diameter of 250 μm is immersed in liquid composite solders at 250° up to 15 min. Composite solder was prepared by adding various amount of Mo nanoparticles into the Sn-3.8Ag-0.7Cu (SAC) solder paste. The dissolution behavior of Cu ...


Understanding The Effects Of Addition Of Copper Nanoparticles To Sn-3.5 Ag Solder Jan 2011

Understanding The Effects Of Addition Of Copper Nanoparticles To Sn-3.5 Ag Solder

A.S. Md Abdul Haseeb

Purpose - The purpose of this paper is to focus on the fabrication of SAC nanocomposites solder and discuss the effects of nanoCu addition on the structure and properties of resulted nanocomposite solder. Design/methodology/ approach - Ball milling is a nonequilibrium processing technique for producing composite metal particles with submicron homogeneity by the repeated cold welding and fracture of powder particles. This method is believed to offer good processablity, precise control over the solder composition, and produce more homogeneous mixture. Findings - It is found that the melting temperature, the wetting behaviour, and hardness are improved when the Cu nanoparticles are added ...