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Degradation Of Automotive Materials In Palm Biodiesel
Degradation Of Automotive Materials In Palm Biodiesel
A.S. Md Abdul Haseeb
As compared to petroleum diesel, biodiesel is more corrosive for automotive materials. Studies on the characterization of corrosion products of fuel exposed automotive materials are scarce. Automotive fuel system and engine components are made from different ferrous and non-ferrous materials. The present study aims to investigate the corrosion products of different types of automotive materials such as copper, brass, aluminum and cast iron upon exposure to diesel and palm biodiesel. Changes in fuel properties due to exposure of different materials were also examined. Degradation of metal surface was characterized by digital camera, SEM/EDS and X-ray diffraction (XRD). Fuel properties were …
Stability Of Molybdenum Nanoparticles In Sn-3.8ag-0.7cu Solder During Multiple Reflow And Their Influence On Interfacial Intermetallic Compounds
A.S. Md Abdul Haseeb
This work investigates the effects of molybdenum nanoparticles on the growth of interfacial intermetallic compound between Sn-3.8Ag-0.7Cu solder and copper substrate during multiple reflow. Molybdenum nanoparticles were mixed with Sn-3.8Ag-0.7Cu solder paste by manual mixing. Solder samples were reflowed on a copper substrate in a 250 °C reflow oven up to six times. The molybdenum content of the bulk solder was determined by inductive coupled plasma-optical emission spectrometry. It is found that upon the addition of molybdenum nanoparticles to Sn-3.8Ag-0.7Cu solder, the interfacial intermetallic compound thickness and scallop diameter decreases under all reflow conditions. Molybdenum nanoparticles do not appear to …
Die Attach Properties Of Zn-Al-Mg-Ga Based High-Temperature Lead-Free Solder On Cu Lead-Frame
Die Attach Properties Of Zn-Al-Mg-Ga Based High-Temperature Lead-Free Solder On Cu Lead-Frame
A.S. Md Abdul Haseeb
No abstract provided.
Effects Of Addition Of Copper Particles Of Different Size To Sn-3.5ag Solder
Effects Of Addition Of Copper Particles Of Different Size To Sn-3.5ag Solder
A.S. Md Abdul Haseeb
No abstract provided.