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Effects Of Binary Solvent System On Morphology Of Particles, Patrick Besana
Effects Of Binary Solvent System On Morphology Of Particles, Patrick Besana
HIM 1990-2015
Recent advancements in cancer research has led to the synthesis of a new drug known as docetaxel. Meant to replace paclitaxel, its more natural counterpart whose ingredients are difficult to obtain, the drug is known to effectively treat a wide array of cancers, including breast cancer, ovarian cancer, and prostate cancer. The establishment of a synthetic alternative to paclitaxel has increased its bioavailability, thereby lowering the cost needed to utilize the drug. Still, the limiting factor in minimizing costs is the method in which the drug is processed. Current methods in drug processing have their limitations, which include the introduction …
High Temperature Transient Creep Analysis Of Metals, Sara Mirmasoudi
High Temperature Transient Creep Analysis Of Metals, Sara Mirmasoudi
Browse all Theses and Dissertations
The ability to design vehicles capable of reaching hypersonic speeds has become a necessity to satisfy industry requirements, hence requiring the need for better understanding of creep behavior of materials. Although the steady state creep of metals has been analyzed rigorously, there is little known about transient creep of many metals. Understanding transient creep behavior of metals is crucial in analysis and design of short term hypersonic flight applications. Hence, a transient creep analysis of 304SS, Al7075-T6, Al2024-T6, Inconel 625, Inconel 718, and Rene N4 is carried out focusing on the microstructural behavior of these metals undergoing high temperature operating …
Intermixing Reactions In Electrodeposited Cu/Sn And Cu/Ni/Sn Multilayer Interconnects During Room Temperature And High Temperature Aging
Faculty of Engineering University of Malaya
Current push for miniaturization and 3D packaging makes it important to understand reactions in interconnects with ultra small volume. In order to reduce processing time and to have more homogeneous interconnects, solder can be designed in a multilayer form with components layer thickness in the sub-micron or even nanometer range. In this work, reaction kinetics in multilayer interconnects consisting stacks of Cu/Sn/Cu and Cu/Ni/Sn/Ni/Sn deposited by electrodeposition were investigated at room temperature and 150 A degrees C. The progress of the reaction in the multilayers was monitored by using XRD, SEM and EDX. Results show that by inserting a 70 …