Business Commons^™

The Socio-Economic Role Of Crude Oil In The United States And Finland, Judith Deak Kallo

Theses

Running a company requires daily assessment of opportunities, risks and trends which involve socio-economic changes and scientific uncertainties. Technical-material resources play a major role in the uncertainty of corporate economics. Overproduction combined with increasing efficiencies have resulted in accelerated use and misuse of resources, accompanied by socio-ecological abuses related to wars and pollution. A significant current threat is global warming. As a result of this global challenge several companies have moved towards a more comprehensive environmental business management model. This is seen in corporate management initiating life cycle assessment and risk analysis of their products.

The socio-economic role of crude …

Evaluation Of Sale Forecasting Methods : A Case Study, Susan J. Canavan

Theses

This study investigated forecasting accuracy for sales. Three quantitative and one qualitative forecasting techniques were tested and two combinational models were generated and evaluated.

Three data sets, obtained from a market leader were used to forecast sales. The series represented monthly sales for three years. Three accuracy levels were employed in this study, these are: Mean Absolute Error (MAE), Mean Absolute Percentage Error (MAPE), and Root Mean Square Error (RMSE). Results indicated that the quantitative method outperformed the qualitative method; that combining two or more quantitative methods provide better forecasts than the individual methods; and that combining quantitative and qualitative …

Design, Simulation And Fabrication Of A Mems In-Situ Contactless Sensor To Detect Plasma Induced Damage During Reactive Ion Etching, Subramanian Ganesh

Theses

The present trend in the semiconductor industry is towards submicron devices. An inevitable process technique in achieving this is by reactive ion etching of the polysilicon gate. During RIE, the gate oxide may get damaged due to several causes. One of the main causes of the damage is the non-uniformity of the plasma. It is reported that these plasma inconsistencies are mainly due to electrode design and that they create spatial plasma potential fluctuation. These fluctuations are reported to be in the range of 10-20 Volts. By providing an in-situ monitoring of the wafers, the reliability of the device could …