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An Introduction To Nanomaterials For Nanopackaging, James E. Morris

Electrical and Computer Engineering Faculty Publications and Presentations

The multiple purposes of an electronics “package” include the provision of mechanical support to the silicon chip, for example, and protection from the environment, the delivery of power in and the facilitation of heat out, and the reliable input and output of information signals, whether electrical or optical. In the age of heterogeneous integration, this includes the internal conversion of signal modes between multiple technologies within the package, while maintaining the traditional requirement of reliable information transmission between packages, e.g., on a traditional circuit board. This article presents some selected examples of nanopackaging, i.e., the application of nanotechnologies, (nanoparticles, carbon …