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Iowa State University

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Mechanical Engineering

Aerospace Engineering Publications

Publication Year

Articles 1 - 2 of 2

Full-Text Articles in Physics

Imaging Stress And Magnetism At High Pressures Using A Nanoscale Quantum Sensor, S. Hsieh, P. Bhattacharyya, C. Zu, T. Mittiga, T. J. Smart, F. Machado, B. Kobrin, T. O. Hohn, N. Z. Rui, Mehdi Kamrani, S. Chatterjee, S. Choi, M. Zaletel, V. V. Struzhkin, J. E. Moore, Valery I. Levitas, R. Jeanloz, N. Y. Yao Dec 2018

Imaging Stress And Magnetism At High Pressures Using A Nanoscale Quantum Sensor, S. Hsieh, P. Bhattacharyya, C. Zu, T. Mittiga, T. J. Smart, F. Machado, B. Kobrin, T. O. Hohn, N. Z. Rui, Mehdi Kamrani, S. Chatterjee, S. Choi, M. Zaletel, V. V. Struzhkin, J. E. Moore, Valery I. Levitas, R. Jeanloz, N. Y. Yao

Aerospace Engineering Publications

Pressure alters the physical, chemical and electronic properties of matter. The development of the diamond anvil cell (DAC) enables tabletop experiments to investigate a diverse landscape of high-pressure phenomena ranging from the properties of planetary interiors to transitions between quantum mechanical phases. In this work, we introduce and utilize a novel nanoscale sensing platform, which integrates nitrogen-vacancy (NV) color centers directly into the culet (tip) of diamond anvils. We demonstrate the versatility of this platform by performing diffraction-limited imaging (~600 nm) of both stress fields and magnetism, up to pressures ~30 GPa and for temperatures ranging from 25-340 K. For ...


Simulation Of Chemical Mechanical Planarization Of Copper With Molecular Dynamics, Y. Ye, Rana Biswas, Ashraf F. Bastawros, Abhijit Chandra Sep 2002

Simulation Of Chemical Mechanical Planarization Of Copper With Molecular Dynamics, Y. Ye, Rana Biswas, Ashraf F. Bastawros, Abhijit Chandra

Aerospace Engineering Publications

With an aim to understanding the fundamental mechanisms underlying chemical mechanical planarization ~CMP! of copper, we simulate the nanoscale polishing of a copper surface with molecular dynamics utilizing the embedded atom method. Mechanical abrasion produces rough planarized surfaces with a large chip in front of the abrasive particle, and dislocations in the bulk of the crystal. The addition of chemical dissolution leads to very smooth planarized copper surfaces and considerably smaller frictional forces that prevent the formation of bulk dislocations. This is a first step towards understanding the interplay between mechanistic material abrasion and chemical dissolution in chemical mechanical planarization ...