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Iowa State University

Series

Chemical Engineering

2002

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Full-Text Articles in Physics

Effect Of Impurities On Interfacial Void Formation In Aluminum, Renchun Huang, Kurt R. Hebert, Thomas Gessmann, Kelvin G. Lynn Jan 2002

Effect Of Impurities On Interfacial Void Formation In Aluminum, Renchun Huang, Kurt R. Hebert, Thomas Gessmann, Kelvin G. Lynn

Chemical and Biological Engineering Conference Presentations and Proceedings

The effect of impurities on formation of interfacial metallic voids, during uniform dissolution of aluminum in 1 M NaOH, was investigated. These voids are thought to act as initiation sites for pitting. Foils of three different bulk purities were used: 99.98% (3N), 99.997% (4N), and 99.9995% (5N). Positron Annihilation Spectroscopy (PAS) and Atomic Force Microscopy (AFM) revealed that nm-scale voids were formed by dissolution in each foil. The void volume fraction increased to a maximum during dissolution, at a time which increased with foil purity. The concurrent accumulation of near-surface Cu and Fe impurities during caustic etching ...