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Technology, Science, And Environtmental Impact Of A Novel Cu-Ag Core-Shell Solderless Interconnect System, Milea Joy Kammer Jul 2014

Technology, Science, And Environtmental Impact Of A Novel Cu-Ag Core-Shell Solderless Interconnect System, Milea Joy Kammer

Open Access Dissertations

Tin-based solder is ubiquitous in microelectronics manufacturing and plays a critical role in electronic packaging and attachment. While manufacturers of consumer electronics have made the transition to the use of lead-free solder, there are still a variety of reliability issues associated with these lead-free alternatives, particularly for high performance, high reliability applications. Because of these performance short-comings, researchers are still searching for a material, an alloy, or a unique alternative that can meet the thermal, mechanical, and electrical requirements for conventional reflow solder applications. In an effort to produce a more reliable alternative, Kim et al. proposed the low-temperature (200 ...