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Full-Text Articles in Operations Research, Systems Engineering and Industrial Engineering
A Study Of Solder Joint Failure Criteria, Jianbiao Pan, Julie Silk
A Study Of Solder Joint Failure Criteria, Jianbiao Pan, Julie Silk
Industrial and Manufacturing Engineering
One of the challenges in an experimental study of solder joint reliability is to determine when cracks occur in a solder joint or when a solder joint fails. Cracks in a real solder joint are difficult to identify using an X-Ray system. Cross-sectioning and scanning electron microscopy (SEM) is a destructive method. A common non-destructive test method is to monitor resistance increase in a solder joint or a daisy-chain. However, no scientific research has been done in establishing the relationship between the crack area of an interconnection and the change in resistance of the interconnection. This paper proposes a method …
Effect Of Gold Content On The Reliability Of Snagcu Solder Joints, Jianbiao Pan, J. Silk, M. Powers, P. Hyland
Effect Of Gold Content On The Reliability Of Snagcu Solder Joints, Jianbiao Pan, J. Silk, M. Powers, P. Hyland
Industrial and Manufacturing Engineering
Electroplated Ni/Au over Cu is a popular metallization for printed circuit board finish as well as for component leads, especially wire-bondable high-frequency packages, where the gold thickness requirement for wire bonding is high. The general understanding is that less than 3 wt% of Au is acceptable in SnPb solder joints. However, little is known about the effect of Au content on the reliability of SnAgCu solder joints. The purpose of this paper is to determine the acceptable level of Au in SAC305 solder joints. Three different package platforms with different Au thicknesses were assembled on boards with two different Au …
Evolving A Summer Engineering Camp Through Assessment, Katherine Chen, Lizabeth Schlemer, Heather Scott Smith, Teana Fredeen
Evolving A Summer Engineering Camp Through Assessment, Katherine Chen, Lizabeth Schlemer, Heather Scott Smith, Teana Fredeen
Industrial and Manufacturing Engineering
EPIC (Engineering Possibilities in College) is a one-week summer program for high school students (entering 9th-12th grades) to learn about engineering and experience hands-on labs in a university atmosphere. It's an opportunity for students to explore the different types of engineering available at many universities. The aim of EPIC is to expand the College of Engineering mission to K-12 students: "To educate students for careers of service, leadership and distinction in engineering or other fields by using a participatory, learn by doing, ‘hands-on’ approach".
The Inside-Out Classroom: A Win-Win Strategy For Teaching With Technology, Daniel J. Waldorf, Lizabeth Schlemer
The Inside-Out Classroom: A Win-Win Strategy For Teaching With Technology, Daniel J. Waldorf, Lizabeth Schlemer
Industrial and Manufacturing Engineering
As costs of higher education soar and many universities face uncertain funding models, institutional pressures have increased to improve instructor efficiency. At the same time, U.S. industry leaders and leading educators have called for improvements in engineering education based on more interactive, hands-on student learning experiences. Although many efforts have been made to take advantage of technology to either improve student learning or to maintain student learning while increasing instructor efficiency, few approaches have been shown to improve both learning and efficiency. A teaching method is proposed to improve student learning and increase student satisfaction while also addressing the instructors’ …
Design Projects With Out-Of-Town Companies, Lizabeth Schlemer
Design Projects With Out-Of-Town Companies, Lizabeth Schlemer
Industrial and Manufacturing Engineering
The capstone design class in the industrial engineering department at California Polytechnic State University, San Luis Obispo (Cal Poly) includes projects with companies. The projects are large ambiguous facilities design problems that allow students to incorporate many aspects of the IE curriculum. For the past 15 years students have been participating in these projects with local companies. Over the past several years, companies from out of town (200 miles to the north in Mountain View or 200 miles to the south in Oxnard) have participated. These out of town companies have presented certain logistical issues, but they have proven to …
Effect Of Gold Content On The Reliability Of Snagcu Solder Joints, Jianbiao Pan, Julie Silk, Mike Powers, Patrick Hyland
Effect Of Gold Content On The Reliability Of Snagcu Solder Joints, Jianbiao Pan, Julie Silk, Mike Powers, Patrick Hyland
Industrial and Manufacturing Engineering
Electroplated Ni/Au over Cu is a popular metallization for PCB finish as well as for component leads, especially wire-bondable high frequency packages, where the gold thickness requirement for wirebonding is high. The general understanding is that less than 3 wt% of Au is acceptable in SnPb solder joints. However, little is known about the effect of Au content on the reliability of SnAgCu solder joints. The purpose of this study is to determine the acceptable level of Au in SAC305 solder joints. Three different package platforms with different Au thicknesses were assembled on boards with two different Au thicknesses using …