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Full-Text Articles in Operations Research, Systems Engineering and Industrial Engineering
Review Of Package Warning Labels And Their Effect On Consumer Behaviour With Insights To Future Anticounterfeit Strategy Of Label And Communication Systems, John Spink, Jay Singh, S. Paul Singh
Review Of Package Warning Labels And Their Effect On Consumer Behaviour With Insights To Future Anticounterfeit Strategy Of Label And Communication Systems, John Spink, Jay Singh, S. Paul Singh
Industrial Technology and Packaging
This paper investigates and reviews literature regarding a range of topics important to the research question – the themes apply across all the topics. The topics include label and package warnings, including tamperevident features, to review their effect on the consumer behaviour of changing usage or purchase decisions. This information was then applied to gain insight into anticounterfeit product/package efforts. Based on this research, it appears that there is value for brand marketers to enhance their anticounterfeit efforts and consumer confidence by utilizing warning labels and information labels on their labels or packages. Currently, consumer perception of a domestic counterfeit …
A Study Of Solder Joint Failure Criteria, Jianbiao Pan, Julie Silk
A Study Of Solder Joint Failure Criteria, Jianbiao Pan, Julie Silk
Industrial and Manufacturing Engineering
One of the challenges in an experimental study of solder joint reliability is to determine when cracks occur in a solder joint or when a solder joint fails. Cracks in a real solder joint are difficult to identify using an X-Ray system. Cross-sectioning and scanning electron microscopy (SEM) is a destructive method. A common non-destructive test method is to monitor resistance increase in a solder joint or a daisy-chain. However, no scientific research has been done in establishing the relationship between the crack area of an interconnection and the change in resistance of the interconnection. This paper proposes a method …
Effect Of Gold Content On The Reliability Of Snagcu Solder Joints, Jianbiao Pan, J. Silk, M. Powers, P. Hyland
Effect Of Gold Content On The Reliability Of Snagcu Solder Joints, Jianbiao Pan, J. Silk, M. Powers, P. Hyland
Industrial and Manufacturing Engineering
Electroplated Ni/Au over Cu is a popular metallization for printed circuit board finish as well as for component leads, especially wire-bondable high-frequency packages, where the gold thickness requirement for wire bonding is high. The general understanding is that less than 3 wt% of Au is acceptable in SnPb solder joints. However, little is known about the effect of Au content on the reliability of SnAgCu solder joints. The purpose of this paper is to determine the acceptable level of Au in SAC305 solder joints. Three different package platforms with different Au thicknesses were assembled on boards with two different Au …
Effect Of Processing, Packaging And Vibration Treatment On The Sensory Quality Of Fresh-Cut Apple Slices, M. Siddiq, J. B. Harte, S. P. Singh, A. A. Khan, K. D. Dolan, Koushik Saha
Effect Of Processing, Packaging And Vibration Treatment On The Sensory Quality Of Fresh-Cut Apple Slices, M. Siddiq, J. B. Harte, S. P. Singh, A. A. Khan, K. D. Dolan, Koushik Saha
Industrial Technology and Packaging
Fresh-cut fruit industry has seen tremendous growth in recent years. The present study was designed with the objective of studying the sensory quality of fresh-cut apple slices that were treated with different antibrowning agents, packed in three types of packaging materials and subjected to vibration treatment to simulate commercial transportation. The slices were treated with two commercial antibrowning agents [NatureSeal (Mantrose-Haeuser Co., Inc., Westport, CT, USA) and Ever-Fresh (Kraft Foods, Inc., Rye Brook, NY, USA)] at 5% (w/v) application rate. The treated slices were packaged in 5 oz polystyrene rigid container, 2 lb polyethylene bag or 2 oz polyethylene bag. …
Effect Of Horizontal Offset On Vertical Compression Strength Of Stacked Corrugated Fiberboard Boxes, Jay Singh, S. Paul Singh, Koushik Saha
Effect Of Horizontal Offset On Vertical Compression Strength Of Stacked Corrugated Fiberboard Boxes, Jay Singh, S. Paul Singh, Koushik Saha
Industrial Technology and Packaging
The purpose of this study was to evaluate the effect of horizontal offset on the compression strength of stacked box configurations. Four different boxes of varying sizes and similar board combinations, made from similar flute but different manufacturers were studied. The single box compression strength for each type of box was determined to represent as the control for this study. The compression strength of control boxes were compared to overall strength of a three-high stack and in three different offset configurations. In addition a set of perfectly aligned boxes were compared to overall strength of a three-high stack and in …
Effect Of Palletized Box Offset On Compression Strength Of Unitized And Stacked Empty Corrugated Fiberboard Boxes, S. Paul Singh, Jay Singh, Koushik Saha
Effect Of Palletized Box Offset On Compression Strength Of Unitized And Stacked Empty Corrugated Fiberboard Boxes, S. Paul Singh, Jay Singh, Koushik Saha
Industrial Technology and Packaging
The purpose of this study was to evaluate the effect of pallet type, tie-sheet and stack configuration on compression strength of a palletized load of boxes. Four boxes made from similar board grade and different dimensions were selected for this study. The column stack configuration which represented the control was compared with the 3 stack configurations either on a CHEP® or GMA pallet. The unitized load either had a tie-sheet in between layers or no tie-sheet between layers of boxes on the respective pallets, for compression strength comparison with the control unitized load represented by a column stack configuration. This …
Evolving A Summer Engineering Camp Through Assessment, Katherine Chen, Lizabeth Schlemer, Heather Scott Smith, Teana Fredeen
Evolving A Summer Engineering Camp Through Assessment, Katherine Chen, Lizabeth Schlemer, Heather Scott Smith, Teana Fredeen
Industrial and Manufacturing Engineering
EPIC (Engineering Possibilities in College) is a one-week summer program for high school students (entering 9th-12th grades) to learn about engineering and experience hands-on labs in a university atmosphere. It's an opportunity for students to explore the different types of engineering available at many universities. The aim of EPIC is to expand the College of Engineering mission to K-12 students: "To educate students for careers of service, leadership and distinction in engineering or other fields by using a participatory, learn by doing, ‘hands-on’ approach".
The Inside-Out Classroom: A Win-Win Strategy For Teaching With Technology, Daniel J. Waldorf, Lizabeth Schlemer
The Inside-Out Classroom: A Win-Win Strategy For Teaching With Technology, Daniel J. Waldorf, Lizabeth Schlemer
Industrial and Manufacturing Engineering
As costs of higher education soar and many universities face uncertain funding models, institutional pressures have increased to improve instructor efficiency. At the same time, U.S. industry leaders and leading educators have called for improvements in engineering education based on more interactive, hands-on student learning experiences. Although many efforts have been made to take advantage of technology to either improve student learning or to maintain student learning while increasing instructor efficiency, few approaches have been shown to improve both learning and efficiency. A teaching method is proposed to improve student learning and increase student satisfaction while also addressing the instructors’ …
Design Projects With Out-Of-Town Companies, Lizabeth Schlemer
Design Projects With Out-Of-Town Companies, Lizabeth Schlemer
Industrial and Manufacturing Engineering
The capstone design class in the industrial engineering department at California Polytechnic State University, San Luis Obispo (Cal Poly) includes projects with companies. The projects are large ambiguous facilities design problems that allow students to incorporate many aspects of the IE curriculum. For the past 15 years students have been participating in these projects with local companies. Over the past several years, companies from out of town (200 miles to the north in Mountain View or 200 miles to the south in Oxnard) have participated. These out of town companies have presented certain logistical issues, but they have proven to …
A System Model For Green Manufacturing, Ahmed M. Deif
A System Model For Green Manufacturing, Ahmed M. Deif
Industrial Technology and Packaging
Manufacturing systems evolution is afunction in multiple external and internal factors. With today’s global awareness of environmental risks as well as the pressing needs to compete through efficiency, manufacturing systems are evolving into a new paradigm. This paper presents a system model for the new green manufacturing paradigm. The model captures various planning activities to migrate from a less green into a greener and more eco-efficient manufacturing. The various planning stages are accompanied by the required control metrics as well as various green tools in an open mixed architecture. The system model is demonstrated by an industrial case study. The …
Effect Of Gold Content On The Reliability Of Snagcu Solder Joints, Jianbiao Pan, Julie Silk, Mike Powers, Patrick Hyland
Effect Of Gold Content On The Reliability Of Snagcu Solder Joints, Jianbiao Pan, Julie Silk, Mike Powers, Patrick Hyland
Industrial and Manufacturing Engineering
Electroplated Ni/Au over Cu is a popular metallization for PCB finish as well as for component leads, especially wire-bondable high frequency packages, where the gold thickness requirement for wirebonding is high. The general understanding is that less than 3 wt% of Au is acceptable in SnPb solder joints. However, little is known about the effect of Au content on the reliability of SnAgCu solder joints. The purpose of this study is to determine the acceptable level of Au in SAC305 solder joints. Three different package platforms with different Au thicknesses were assembled on boards with two different Au thicknesses using …
Evaluation Of An Innovative System For Improving Readability Of Passive Uhf Rfid Tags Attached To Reusable Plastic Containers, Jay A. Singh, S. Roy, B. Roesner
Evaluation Of An Innovative System For Improving Readability Of Passive Uhf Rfid Tags Attached To Reusable Plastic Containers, Jay A. Singh, S. Roy, B. Roesner
Industrial Technology and Packaging
Radio frequency identification (RFID) is a contactless identification technology that has proven to work well in conjunction with reusable plastic containers (RPCs). The impact of this technology on returnable containers has been explored by several past studies. This study evaluates an innovative system for improving readability of passive UHF RFID tags in conjunction with RPCs. The system involves an energy transfer device (ETD), which when attached to the RPCs, passively transfers radio frequency signals to interior regions of a unitized load thereby improving the readability of all RFID tags attached to the RPCs. This study included an evaluation of the …
An Exploratory Model For Predicting Post-Consumer Recycled Pet Content In Pet Sheets, Dong Ho Kang, Rafael Auras, Keith Vorst, Jay Singh
An Exploratory Model For Predicting Post-Consumer Recycled Pet Content In Pet Sheets, Dong Ho Kang, Rafael Auras, Keith Vorst, Jay Singh
Industrial Technology and Packaging
An exploratory model for determining post-consumer recycled polyethylene terephthalate (PET) content in PET sheets for one specific stream of mechanically recycled PET (RPET) was developed. Six kinds of PET sheets with varying percent of virgin (V) and recycled (R) PET contents (i.e., 100V, 80V20R, 60V40R, 40V60R, 20V80R, and 100R PET) were commercially extruded. The optical, thermal, physicomechanical and barrier properties of the PET sheets were evaluated as function of RPET content. Differences were found between the sheets for UV and visible light absorption in the regions 200–350 nm and 670–700 nm, respectively. Intrinsic viscosities of 100V and 100R PET sheets …
Life Cycle Inventory Of Hdpe Bottle-Based Liquid Milk Packaging Systems, Jay Singh, Aric Krasowski, S. Paul Singh
Life Cycle Inventory Of Hdpe Bottle-Based Liquid Milk Packaging Systems, Jay Singh, Aric Krasowski, S. Paul Singh
Industrial Technology and Packaging
This study aims at providing a relatively straightforward methodology to serve as a decision-making tool when more than one packaging solution could be available to a user. It involves a life cycle inventory (LCI) analysis and comparison of three currently available 3.79 l (1 gallon) packaging systems for liquid milk. Two of the primary container types studied use reusable plastic crates (RPCs) for stacking and shipping,
while the third type is a heavier duty container that does not require secondary shipping containers. The three primary containers studied are identified as original, cube and stackable throughout this paper. The study shows …
A Multiple Performance Analysis Of Market-Capacity Integration Policies, Ahmed M. Deif, Hoda A. Elmaraghy
A Multiple Performance Analysis Of Market-Capacity Integration Policies, Ahmed M. Deif, Hoda A. Elmaraghy
Industrial Technology and Packaging
A model that uses simulation augmented with Design of Experiments (DOE) is presented to analyse the performance of a Make-to-Order (MTO) reconfigurable manufacturing system with scalable capacity. Unlike the classical capacity scaling policies, the proposed hybrid capacity scaling policy is determined using multiple performance measures that reflect cost, internal stability and responsiveness. The impact of both tactical capacity and marketing policies and their interaction on the overall performance was analysed using DOE techniques and real case data. In addition to the different insights about the trade-offs involved in capacity planning decisions, the presented results challenged the conventional capacity planning wisdoms …