Operations Research, Systems Engineering and Industrial Engineering Commons^™

Variability In Compression Strength And Deflection Of Corrugated Containers As A Function Of Positioning, Operators, And Climatic Conditions, Jay A. Singh, P. Bainbridge, S. P. Singh, Eric Olsen

Industrial Technology and Packaging

ASTM D642 is a commonly used standard for measuring the ability of containers to resist external compressive loads applied to its faces, to diagonally opposite edges, or to corners. The procedure recommends testing by centering the specimen on the lower platen of the testing machine in the desired orientation, so as not to incur eccentric loading. It is also recommended by the standard that the load be applied with a continuous motion of the movable platen of the testing machine at a speed of 0.5 ±0,1 in. (12.7 ± .25 cm)/min until failure or a specified load, has been reached. …

Measurement And Analysis Of Vibration Levels On Warehouse And Retail Store Material Handling Equipment, S. P. Singh, Jay A. Singh, P. Gaur, K. Saha

Industrial Technology and Packaging

Material Handling Equipment (MHE) is widely used to move packaged goods from manufacturing to warehousing, storage, transportation, in both warehouses and distribution centers to retail stores. Moving product between facilities is done by different types of equipment ranging from manually pushed carts to automated vehicles. A considerable amount of research has been conducted to evaluate the ergonomics of manual or mechanized MHE in the past. There is, however, no published work documenting vibration conditions that occur when transporting packages using MHE. This study measured the vibration levels for typical MHE used at warehousing facilities. Power spectral density plots were generated …

An Examination Of The Variables Affecting Rfid Tag Readability In A Conveyer Belt Environment, Jay A. Singh, C. Deupser, Eric Olsen, S. P. Singh

Industrial Technology and Packaging

There is a growing list of companies implementing radio frequency identification (RFID) systems to help optimize their supply chain processes. These companies realize that a successful RFID system can potentially lead to lower supply chain inventory levels, reduced operating expenses, and greater visibility throughout the supply chain. However, since RFID technology is still relatively immature, a majority of the applications experience less than perfect read rates for tagged items moving through the supply chain. This paper reports the results for a variety of different arrangements of variables that may influence the readability of the RFID tags in a conveyer belt …

Designing And Manufacturing Microelectronic Packages For High-Power Light-Emitting Diodes, Brian Wright, Jianbiao Pan, Richard Savage

Industrial and Manufacturing Engineering

A new microelectronic package was designed for a high-power light-emitting diode (LED). The objective was to build a package that enables the LED to operate with currents as high as 2 Amps. An innovative thin-film interface has been developed to electrically connect the cathode of the LED die to a 22AWG Cu wire. This thin-film interface is wirebondable and solderable, and consists of three layers: Au, Ni93/V7, and Si. Four 1 mil Au wirebonds, supporting 2A of maximum current, connect the Au thin-film to the LED die cathode. Sn96Ag4 solder is used for connecting the Ni93/V7 thin-film to the 22AWG …

Measurement And Analysis Of Truck And Rail Shipping Environment In India, Sher Paul Singh, A. P. S. Sandhu, Jay A. Singh, E. Joneson

Industrial Technology and Packaging

Free trade agreements have been on the rise in all regions of the world in the past decade. This has allowed for global distribution and marketing of products in an international market. Products once produced for domestic markets must now be able to compete in international markets without trade barriers. Increased international commerce and manufacturing have forced many packaging and logistics engineers to broaden their true understanding of the global distribution environment. India is a recent entrant on the global arena for manufacturing and services. While China’s economic developments have dominated global headlines, India’s own growth has been impressive as …

Measurement And Analysis Of International Air Parcel Shipping Environment For Dhl And Fedex Between Europe And United States, Manuel-Alfredo Garcia-Romeu-Martinez, S. Paul Singh, Vicente-Agustin Cloquell-Ballester, Koushik Saha

Industrial Technology and Packaging

Various studies have been conducted to determine the dynamics that single packages undergo during distribution between destinations as a function of package size and weight and carrier. Previous studies have normally focused on regional and domestic measurements of these environments in Europe and North America. However, no information is available to determine the international handling and shipping environment of single parcels between the two continents. This study used instrumented packages containing triaxial accelerometers. The measured shocks were analysed to determine the velocity change levels as a function of the events measured in the distribution environment and to develop data for …

In-House Development Of Scheduling Decision Support Systems: Case Study For Scheduling Semiconductor Device Test Operations, Tali Freed, K. H. Doerr, T. Chang

Industrial and Manufacturing Engineering

Most manufacturing processes can benefit from an automated scheduling system. However;: the design of a fast, computerised scheduling system that achieves high-quality results and requires minimal resources is a difficult undertaking. Efficient .. scheduling of a semiconductor device test facility requires an information system that provides good schedules quickly. Semiconductor device testing-is the last stage of the long semiconductor manufacturing process, and therefore. is subjected to customer service pressures. The cost of an off-the-shelf computerised scheduling system may he prohibitive for many companies. In addition, many companies are taken aback by other characteristics of off-the-shelf scheduling systems, such as code …

Fabrication Of Functionally Graded 3a/5a Zeolites By Electrophoretic Deposition, X. Wang, E. A. Olevsky, E. Bruce, M. B. Stern, D. T. Hayhurst

Industrial and Manufacturing Engineering

Functionally graded zeolites of molecular sieve type 3A and 5A are deposited by electrophoretic deposition (EPD) from acetone suspension with 8% volume concentration of n-butylamine as particle charging agent. The EPD characteristics of both 3A and 5A suspensions are studied. Functionally graded zeolite 3A/5A deposits are obtained at 200 V DC. Energy dispersive X-ray dispersion (EDX) analysis results confirm the graded structure. The deposited zeolites are also analysed by scanning electron microscopy (SEM). The factors influencing the deposition process are discussed.

The Benefits Of Automatic Data Collection In The Fresh Produce Supply Chain, Ryan Charles Panos, Tali Freed

Industrial and Manufacturing Engineering

The potential for RFID based systems to improve the safety and efficiency of a supply chain with rapidly decaying products and strict health standards is creating pressure to adopt RFID in several agricultural industries. A handful of fresh produce industry leaders currently participate in mandated pilot projects, while the industry as a whole is still intimidated by the perceived cost of RFID. Therefore in this study we attempt to validate the correlation between performance and automated data collection, paving the way to economic justification of investment in data collection technologies, such as barcode and RFID.

The majority of product in …

Measurement And Analysis Of The Shocks Generated During Egg Production, Jay A. Singh, Chris Ferrier, Paul Singh

Industrial Technology and Packaging

In their journey from the laying cage to shipments out of an egg production operation, table eggs encounter multiple shock events. While all agricultural commodities run the possibility of damage during the course of production, shell eggs are particularly susceptible to being cracked or broken during the production operation. A typical egg production facility experiences 2% to 7% checks (a partial mechanical failure to the egg shell) during handling, packaging and transportation of shell eggs. It has been estimated that the total losses to the U.S. egg industry due to checks and breakage of eggs during production amounts to over …

Development Of Wholesale Packaging To Prevent Post-Harvest Damage To Rose Apples, Bundit Jarimopas, Siam Toomsaengtong, Sher Paul Singh, Jay Singh, Rangsinee Sothornvit

Industrial Technology and Packaging

The purpose of this research was to determine post-harvest damage to rose apples due to transportation hazards and to comparatively evaluate the performance of the current and proposed wholesale packaging for the fruit. The methodology comprised of sampling and conducting damage analysis of rose apples of two varieties (Thongsamsri and Toonklao) distributed using commercial packaging to various retailers and wholesalers selected at random around the Bangkok metropolitan areas. Three kinds of current wholesale packaging were packed with newly harvested, damage-free, and uniform sized Thongsamsri rose apples and tested using a vibration simulator. The same testing was performed for the two …

Comparison Of Package Cushioning Materials To Protect Post-Harvest Impact Damage To Apples, Bundit Jarimopas, Sher Paul Singh, S. Sayasoonthorn, Jay A. Singh

Industrial Technology and Packaging

Damage to fruits and vegetables continues to be a big challenge as global markets become a reality. Worldwide distribution of sensitive produce is faced with various levels of impacts from shipping and handling. Despite a variety of packaging options available today, bruising damage is commonplace for post-harvest apples throughout the supply chain. The major sources of bruising are compression, impact or vibration forces. Understanding where these forces occur can help reduce this type of mechanical damage to apples. The purpose of this study was to investigate the impact characteristics of foam net and corrugated board when applied as wrapping for …

Assessing Capacity Scalability Policies In Rms Using System Dynamics, Ahmed M. Deif, Hoda A. Elmaraghy

Industrial Technology and Packaging

This paper presents a model for assessing different capacity scalability policies in Reconfigurable Manufacturing System (RMS) for different changing demand scenarios. The novelty of this approach is two fold: (1) it is the first attempt to explore different capacity scalability policies in RMS based on multiple performance measures, mainly scaling rate, Work In Process level, inventory level and backlog level; and (2) the dynamic scalability process in RMS is modeled for the first time using System Dynamics. Different policies for capacity scalability for various demand scenarios were assessed. Numerical simulation results obtained using the developed capacity scalability model showed that …

Measurement, Analysis, And Comparison Of The Parcel Shipping Shock And Drop Environment Of The United States Postal Service With Commercial Carriers, J. A. Singh, S. P. Singh, G. Burgess, K. Saha

Industrial Technology and Packaging

The past decade has shown a great increase in the number of direct to consumer shipments of products and packages. As a result, parcel delivery companies like DHL, FedEx, UPS, and the USPS have strengthened their presence in air transport to deliver products faster and through larger distances. Using cargo planes, they route packages from various destinations to large airport hubs, where they sort millions of packages and ship them to their destinations. There is a continuous need to quantify what happens to these packages as they are handled both manually during collection and delivery and on large high-speed conveying …

Fabrication Of Net-Shape Functionally Graded Composites By Electrophoretic Deposition And Sintering: Modeling And Experimentation, E.A. Olevsky, X. Wang, A. Maximenko, M.A. Meyers

Industrial and Manufacturing Engineering

It is shown that electrophoretic deposition (EPD) sintering is a technological sequence that is capable of producing net-shape bulk functionally graded materials (FGM). By controlling the shape of the deposition electrode, components of complex shapes can be obtained. To enable sintering net-shape capabilities, a novel optimization algorithm and procedure for the fabrication of net-shape functionally graded composites by EPD and sintering has been developed. The initial shape of the green specimen produced by EPD is designed in such a way that the required final shape is achieved after sintering-imposed distortions. The optimization is based on a special innovative iteration procedure …

Agile Mpc System Linking Manufacturing And Market Strategies, Ahmed M. Deif, Waguih H. Elmaraghy

Industrial Technology and Packaging

Increasing complexity and interdependency in manufacturing enterprises require an agile manufacturing paradigm. This paper considers a dynamic control approach for linking manufacturing strategy with market strategy through a reconfigurable manufacturing planning and control (MPC) system to support agility in this context. A comprehensive MPC model capable of adopting different MPC strategies through distributed controllers of inventory, capacity, and WIP is presented. A hierarchical supervisory controller (referred to as decision logic unit, DLU) that intakes the high-level strategic market decisions and constraints together with feedback of the current manufacturing system state (WIP, production, and inventory levels) and optimally manages the distributed …

Investigation Of The Lead-Free Solder Joint Shear Performance, James Webster, Jianbiao Pan, Brian J. Toleno

Industrial and Manufacturing Engineering

Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The purpose of this study is to investigate the effects of reflow profile and thermal shock on the shear performance of eutectic SnPb (SnPb) and Sn3.0Ag0.5Cu (SAC305) solder joints. Test boards were assembled with four different sized surface mount chip resistors (1206, 0805, 0603 and 0402). Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb were developed with three levels of peak temperature (12ºC, 22ºC, and 32ºC above solder liquidus temperature, or 230ºC, 240ºC, and 250ºC for SAC …

Investigating Optimal Capacity Scalability Scheduling In A Reconfigurable Manufacturing System, Ahmed M. Deif, Waguih Elmaraghy

Industrial Technology and Packaging

Responsiveness to dynamic market changes in a cost-effective manner is becoming a key success factor for any manufacturing system in today’s global economy. Reconfigurable manufacturing systems (RMSs) have been introduced to react quickly and effectively to such competitive market demands through modular and scalable design of the manufacturing system on the system level, as well as on the machine components’ level. This paper investigates how RMSs can manage their capacity scalability on the system level in a cost-effective manner. An approach for modeling capacity scalability is proposed, which, unlike earlier approaches, does not assume that the capacity scalability is simply …

Synthesis Of Gold Micro- And Nano-Wires By Infiltration And Thermolysis, E.A. Olevsky, X. Wang, E. Bruce, M.B. Stern, S. Wildhack, F. Aldinger

Industrial and Manufacturing Engineering

An approach for synthesizing micro- and nano-sized gold wires by infiltration and thermolysis is investigated. A porous ZrO₂ ceramic preform with aligned pores obtained by unidirectional freezing and freeze-drying is employed as an infiltration template. The sintered porous ZrO₂ preform is then infiltrated by a brushing gold solution. The thermolysis is conducted at 600 °C in air. Micro- and nano-sized gold wires are developed within the walls of the pores after thermolysis. The diameter of the gold wires ranges from several hundred nanometers to several microns.

Improving Factory Layout Under A Mixed Floor And Overhead Material Handling Condition, Manocher Djassemi

Industrial Technology and Packaging

Purpose –In spite of having a number of general-purpose algorithms for solving plant layout problems, facility planners may still face a challenging task to adjust these algorithms to handle special, but not uncommon, layout problems. The purpose of this study is to propose a new method for addressing the impact of overhead space utilization on a plant layout solution.

Design/methodology/approach –A new method for adjusting material flow under a mixed floor and overhead material handling condition is incorporated in an existing plant layout procedure. A case study involving the layout improvement in a lawn mower engine assembly facility …

Backward And Forward Compatibility, Jianbiao Pan, Jasbir Bath, Xiang Zhou, Dennis Willie

Industrial and Manufacturing Engineering

In response to the European Union (EU) Restriction of Hazardous Substances (RoHS) and other countries’ impending lead-free directives, the electronics industry is moving toward lead-free soldering. Total lead-free soldering requires not only lead-free solder paste but also lead-free printed circuit board (PCB) finish and lead-free component/packages. Transitioning tin-lead (SnPb) soldering to totally lead-free soldering is a complex issue and involves movement of the whole electronics industry supply chain. In reality, there is a transition period.