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Full-Text Articles in Operations Research, Systems Engineering and Industrial Engineering
The Analysis And Modeling Of Fine Pitch Laminate Interconnect In Response To Large Energy Fault Transients , Joel Arlen Jorgenson
Retrospective Theses and Dissertations
In embedded applications, the miniaturization of circuitry and functionality provides many benefits to both the producer and consumer. However, the benefits gained from miniaturization is not without penalty, as the environmental influences may be great enough to introduce system failures in new or different modes and effects;Of particular interest within this research is the effect of fault transients in reduced geometries of printed circuit card interconnect, commonly referred to as fine pitch laminate interconnect. Whereas larger geometries of conductor trace width and spacing may have been immune to circuit failure at a given fault input, the reduction of the ...