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Full-Text Articles in Operations Research, Systems Engineering and Industrial Engineering

Dynamic Analysis Of Less-Than-Truckload Shipments And Test Method To Simulate This Environment, Sher Paul Singh, E. Joneson, Jay Singh, G. Grewal Dec 2008

Dynamic Analysis Of Less-Than-Truckload Shipments And Test Method To Simulate This Environment, Sher Paul Singh, E. Joneson, Jay Singh, G. Grewal

Industrial Technology and Packaging

This paper provides results from a comprehensive data measurement study that analyzed the vibration dynamics produced inside the trailers used for less-than truckload (LTL) shipments. The trailers used for this segment of the package transportation environment are very different in size and suspension than those used for full truckload shipments. This study measured the vertical, lateral and longitudinal vibration inside a trailer as a function of road surface. In addition, the study developed a video showing freight movement inside the trailer to determine physical displacement and shifting of the loads. A set of recommendations was developed to safely load and ...


A Computer-Based Economic Analysis For Manufacturing Process Selection, Manocher Djassemi Nov 2008

A Computer-Based Economic Analysis For Manufacturing Process Selection, Manocher Djassemi

Industrial Technology and Packaging

An important part of financial planning in product development is considering whether the capital expenditures meet volume and cost goals. A good business plan should provide investors with the implications of process selection on the company's bottom line. It is estimated that there are least 1000 manufacturing processes and sub-processes. Considering the number of process choices and quantity of cost data, an economic analysis for process selection may pose a challenge for decision makers. This paper provides an insight to Ashby’s cost modeling method for generating an estimate of unit product cost. The cost model provides a broad ...


Drop Impact Dynamic Response Study Of Jedec Jesd22-B111 Test Board, Michael Krist, Jianbiao Pan, Andrew Farris, Nicolas Vickers Nov 2008

Drop Impact Dynamic Response Study Of Jedec Jesd22-B111 Test Board, Michael Krist, Jianbiao Pan, Andrew Farris, Nicolas Vickers

Industrial and Manufacturing Engineering

Mobile and handheld electronic devices are prone to being dropped. This drop event may result in failure of solder joints inside these devices. The need for RoHS compliant boards coupled with the demand for reliable electronics has resulted in the development of the JEDEC Standard JESD22-B111 to standardize the method of drop testing surface mount electronic components. However, there has been little study on the effects of additional mass on the board and rigidity of the board on drop test reliability. This paper examines the drop impact dynamic responses of the JEDEC JESD22-B111 board. Of interest are the effects of ...


The Effect Of Ultrasonic Frequency On Gold Wire Bondability And Reliability, Jianbiao Pan, Minh-Nhat Le, Cuong Van Pham Nov 2008

The Effect Of Ultrasonic Frequency On Gold Wire Bondability And Reliability, Jianbiao Pan, Minh-Nhat Le, Cuong Van Pham

Industrial and Manufacturing Engineering

This paper presents a systematic study on the effect of 120KHz ultrasonic frequency on the bondability and reliability of fine pitch gold wire bonding. The study was carried out on a thermosonic ball bonder that is allowed to easily switch between ultrasonic frequency of 60KHz and 120 KHz by changing the ultrasonic transducer and the ultrasonic generator. Bonding parameters were optimized through design of experiment methodology for four different cases: 25.4 μm wire at 60 kHz, 25.4 μm wire at 120 kHz, 17.8 μm wire at 60 kHz, and 17.8 μm wire at 120 kHz. The ...


Board Level Failure Analysis Of Chip Scale Package Drop Test Assemblies, Nicholas Vickers, Kyle Rauen, Andrew Farris, Jianbiao Pan Nov 2008

Board Level Failure Analysis Of Chip Scale Package Drop Test Assemblies, Nicholas Vickers, Kyle Rauen, Andrew Farris, Jianbiao Pan

Industrial and Manufacturing Engineering

This paper presents the failure analysis results of board level drop tests. In this study, the test vehicle was designed according to the requirements of the Joint Electron Device Engineering Council (JEDEC) drop test board. The test vehicle was assembled with 15 chip scale packages (CSPs) each having 228 daisy-chained 0.5 mm pitch solder joints using Sn-3.0 wt% Ag-0.5 wt% Cu (SAC305) lead free solder. Assemblies were drop tested using three different peak accelerations of 900 G, 1500 G, 2900 G, with 0.7 ms, 0.5 ms, and 0.3 ms pulse durations, respectively. Scanning electron ...


Work In Progress - Enhancing Student-Learning Through State-Of-The-Art Systems Level Design And Implementation, Albert A. Liddicoat, Jianbiao Pan, James G. Harris, Dominic J. Dal Bello, Lynne A. Slivovsky Oct 2008

Work In Progress - Enhancing Student-Learning Through State-Of-The-Art Systems Level Design And Implementation, Albert A. Liddicoat, Jianbiao Pan, James G. Harris, Dominic J. Dal Bello, Lynne A. Slivovsky

Industrial and Manufacturing Engineering

The curriculum for undergraduate engineering programs is often partitioned into several courses that are taught in isolation followed by a single culminating senior design or capstone project experience. In the senior design class students being to synthesize the knowledge and skills that they acquired through the engineering curriculum. This paper presents lower and upper division course and curricular changes made to accommodate learning objectives that better prepare students for project-based learning. These learning experiences and skills include: systems level design, experience with state-of-the-art Computer Aided Design (CAD) tools, printed circuit board (PBC) design, design for manufacturability, electronics assembly, project management ...


Alternative Binder Carbide Tools For Machining Superalloys, Daniel J. Waldorf, Michael Stender, Scott Liu, Daniel Norgan Oct 2008

Alternative Binder Carbide Tools For Machining Superalloys, Daniel J. Waldorf, Michael Stender, Scott Liu, Daniel Norgan

Industrial and Manufacturing Engineering

This study examines the performance of a new class of wear-resistant but economical cutting tools produced by varying the binder composition of standard cemented carbide composites. By replacing some or all of the cobalt binder with rhenium and nickel-based superalloy, a stronger composite tool results, potentially capable of machining heat-resistant superalloys at significantly higher cutting speeds. Sample tools with alternative binder were produced and compared to standard tools bound with cobalt only. Turning experiments on Inconel 718 were run to evaluate wear resistance and tool life for several grades. The experimentation also examined the effects of varying the relative proportions ...


Characterization And Compression Properties Of Injection Molded Carbon Nanotube Composites, Grey Curtzwiler, Jay Singh, J. Miltz, Jimmy Doi, Keith Vorst Jul 2008

Characterization And Compression Properties Of Injection Molded Carbon Nanotube Composites, Grey Curtzwiler, Jay Singh, J. Miltz, Jimmy Doi, Keith Vorst

Industrial Technology and Packaging

Since the development of carbon nanotubes (CNTs) in 1991, they have received much attention with improved mechanical, thermal, and electrical properties of their composites compared to common polymer composites. The CNTs are currently used to increase the modulus of common thermoplastics and thermosets, including urethanes and epoxies. The CNTs are difficult to disperse within any media because of limited chemical reactivity and potential agglomeration in their ‘‘as grown’’ state. This study evaluated the effect of incorporating bundled and unbundled CNTs at different concentrations into Polyurethane/CNT/woven fiber reinforced composites. Optical microscopy and atomic force microscopy (AFM) characterized the dispersion ...


Enhancing Student Learning Through State-Of-The-Art Systems Level Design And Implementation: The Development Of A Lower Division Learning Module, James G. Harris, Dominic Dal Bello, Jianbiao Pan, Albert Liddicoat Jun 2008

Enhancing Student Learning Through State-Of-The-Art Systems Level Design And Implementation: The Development Of A Lower Division Learning Module, James G. Harris, Dominic Dal Bello, Jianbiao Pan, Albert Liddicoat

Industrial and Manufacturing Engineering

The Cal Poly/Allan Hancock team is developing a learning module that will allow all lower division engineering students to design, fabricate, assemble, and test an electronic system implemented on a printed circuit board (PCB). All the services necessary to perform this laboratory experiment will be provided with low-cost vendors available on the . The learning module is being developed so that it can be integrated into the existing electrical engineering lower division courses that are required by all engineering students. The laboratory learning module will use operational amplifiers (op amp), resistors, capacitors and other common electronic components to study the ...


Curricular Enhancement To Support Project-Based Learning In Computer And Electrical Engineering, Albert Liddicoat, Jianbiao Pan, James G. Harris, Lynne A. Slivovsky Jun 2008

Curricular Enhancement To Support Project-Based Learning In Computer And Electrical Engineering, Albert Liddicoat, Jianbiao Pan, James G. Harris, Lynne A. Slivovsky

Industrial and Manufacturing Engineering

Undergraduate computer and electrical engineering programs often partition the curriculum into several courses based on related topics taught in isolation. Students are expected to synthesize their knowledge in a senior design project. It is the authors’ experience that students often struggle during their senior design project since they have not gained the appropriate knowledge or mastered necessary skills needed to work on a significant or team-based engineering design project. Specifically, students need to be able to define system requirements, partition the design into subcomponents, design, build, test, and verify that the system requirements have been met. The authors have enhanced ...


A Project-Based Electronics Manufacturing Laboratory Course For Lower-Division Engineering Students, Jianbiao Pan, Albert Liddicoat, James G. Harris, Dominic Dal Bello Jun 2008

A Project-Based Electronics Manufacturing Laboratory Course For Lower-Division Engineering Students, Jianbiao Pan, Albert Liddicoat, James G. Harris, Dominic Dal Bello

Industrial and Manufacturing Engineering

This paper presents a project-based laboratory course on electronics design and manufacturing. The goal of this course is to provide lower-division engineering students a hands-on experience involving actual printed circuit board (PCB) design, layout, fabrication, assembly, and testing. Through project-based learning, students not only learn technical skills in designing and manufacturing an electronic device, but also develop their project management and communication skills early in their course of study at the university. The course outline and examples of the student projects are presented in this paper as well as project evaluations and students’ feedback. This paper also presents the selection ...


Techniques For Developing Large Scale Fuzzy Logic Systems, Jon C. Ervin, Sema E. Alptekin Jun 2008

Techniques For Developing Large Scale Fuzzy Logic Systems, Jon C. Ervin, Sema E. Alptekin

Industrial and Manufacturing Engineering

In this paper, we describe various techniques used to make Intuitionistic Fuzzy Logic Systems amenable to operating on applications with large numbers of inputs. A rule reduction technique known as Combs method is combined with an automated tuning process based on Particle Swarm Optimization. A second stage of tuning on rule weights results in improved performance and further reduction in the size of the rule-base. The entire process has been developed to operate within the Matlab software environment. The technique is tested against the Wisconsin Breast Cancer Database. The use of these tools shows great promise in significantly expanding the ...


Measurement And Analysis Of Truck Transport Environment In Brazil, Giovani Otavio Rissi, Sher Paul Singh, Gary J. Burgess, Jay A. Singh Jun 2008

Measurement And Analysis Of Truck Transport Environment In Brazil, Giovani Otavio Rissi, Sher Paul Singh, Gary J. Burgess, Jay A. Singh

Industrial Technology and Packaging

Increasing trade in today’s global economy requires packaging to be designed to contain, protect and deliver products without damage during transportation and handling. Vibration forces that occur during transportation are one of the most significant causes of damage during shipping. The objective of this study was to quantify and analyse the vibration that occurs during truck transport in Brazil. The study was done using two types of trucks: small local trucks for local metropolitan distribution areas and larger tractor-trailers for cross-country transportation. Ten metropolitan areas in different regions of Brazil were selected for 1-day trips representing normal delivery. These ...


The Effect Of Ventilation And Hand Holes On Loss Of Compression Strength In Corrugated Boxes, Jay Singh, Eric Olsen, S. P. Singh, J. Manley, F. Wallace Jun 2008

The Effect Of Ventilation And Hand Holes On Loss Of Compression Strength In Corrugated Boxes, Jay Singh, Eric Olsen, S. P. Singh, J. Manley, F. Wallace

Industrial Technology and Packaging

Corrugated packaging is used to package approximately 90% of all products that reach retail store shelves and aisles in the United States. A large number of these corrugated shippers are used to ship fresh produce and perishables through the cold-chain environment that requires these boxes to have venting to permit air circulation. In addition, corrugated boxes for that are large in size and contain heavier products, may have hand holes to facilitate manual handling. The presence of ventilation and hand holes both cause a loss of material in two or more faces of the box. As a result the compression ...


Drop Test Reliability Of Lead-Free Chip Scale Packages, Andrew Farris, Jianbiao Pan, Albert Liddicoat, Brian J. Toleno, Dan Maslyk, Dongkai Shangguan, Jasbir Bath, Dennis Willie, David A. Geiger May 2008

Drop Test Reliability Of Lead-Free Chip Scale Packages, Andrew Farris, Jianbiao Pan, Albert Liddicoat, Brian J. Toleno, Dan Maslyk, Dongkai Shangguan, Jasbir Bath, Dennis Willie, David A. Geiger

Industrial and Manufacturing Engineering

This paper presents the drop test reliability of 0.5 mm pitch lead-free chip scale packages (CSPs). Fifteen 0.5 mm pitch CSPs were assembled on a standard JEDEC drop reliability test board with Sn3.0Ag0.5Cu lead-free solder. Eight boards were edge-bonded with a UV-cured acrylic; eight boards were edge- bonded with a thermal-cured epoxy; and twelve boards were assembled without edge bonding. Half of the edge-bonded test boards were subjected to drop tests at a peak acceleration of 1500 G with a pulse duration of 0.5 ms, and the other half subjected to drop tests at a ...


Effect Of Unitization And Product Types On Readability Of Tagged Packages Of Consumer Goods, Jay A. Singh, R. Holtz, S. P. Singh, K. Saha Mar 2008

Effect Of Unitization And Product Types On Readability Of Tagged Packages Of Consumer Goods, Jay A. Singh, R. Holtz, S. P. Singh, K. Saha

Industrial Technology and Packaging

Proper implementation of radio frequency identification (RFID) has the potential to revolutionize supply chain management. This technology provides simultaneous indirect scanning of multiple packages and palletized loads equipped with a RFID tag, transmitting substantially more information than a bar code. Also, stored information on the tag can be updated according to inventory status, thus, eliminating key limitations of barcode technology. This study was designed to address some of the currently known shortcomings of the RFID technology. One of the commonly occurring drawbacks is transmitted signal from RFID antennae is reflected from metal objects or absorbed by water contained in a ...


Rfid Research And Testing For Packages Of Apparel, Consumer Goods And Fresh Produce In The Retail Distribution Environment, S. P. Singh, M. Mccartney, Jay Singh, R. Clarke Mar 2008

Rfid Research And Testing For Packages Of Apparel, Consumer Goods And Fresh Produce In The Retail Distribution Environment, S. P. Singh, M. Mccartney, Jay Singh, R. Clarke

Industrial Technology and Packaging

Radio frequency identification (RFID) is a term used for any device that can be sensed at a distance by radio frequencies with few problems of obstruction. The origins of the term lie in the invention of tags that reflect or retransmit a radiofrequency signal. According to a recent article by Forrester Research, the minimal ‘Slap and Ship’ approach to RFID compliance will cost an individual company between $2 million and $20 million. Because retailers like Wal-Mart plan to share with their suppliers all the RFID-generated data points (from when a case/pallet enters their distribution centre until it leaves their ...


Performance Comparison Of Thermal Insulated Packaging Boxes, Bags And Refrigerants For Single-Parcel Shipments, S. P. Singh, Gary J. Burgess, Jay Singh Jan 2008

Performance Comparison Of Thermal Insulated Packaging Boxes, Bags And Refrigerants For Single-Parcel Shipments, S. P. Singh, Gary J. Burgess, Jay Singh

Industrial Technology and Packaging

A range of packaging solutions exists for products that must be kept within a specific temperature range throughout the supply-and-distribution chain. This report summarizes the results of studies conducted over a span of 2 years by the Consortium for Distribution Packaging at Michigan State University. Thermal insulation packaging materials such as expanded polystyrene, polyurethane, corrugated fibreboard, ThermalCor® and other composite packaging such as thermal insulating bags were studied. Phase change materials such as gel packs were also evaluated. Properties such as R-value, melting point and heat absorption were examined and are reported.