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Full-Text Articles in Operations Research, Systems Engineering and Industrial Engineering
Drop Impact Dynamic Response Study Of Jedec Jesd22-B111 Test Board, Michael Krist, Jianbiao Pan, Andrew Farris, Nicolas Vickers
Drop Impact Dynamic Response Study Of Jedec Jesd22-B111 Test Board, Michael Krist, Jianbiao Pan, Andrew Farris, Nicolas Vickers
Industrial and Manufacturing Engineering
Mobile and handheld electronic devices are prone to being dropped. This drop event may result in failure of solder joints inside these devices. The need for RoHS compliant boards coupled with the demand for reliable electronics has resulted in the development of the JEDEC Standard JESD22-B111 to standardize the method of drop testing surface mount electronic components. However, there has been little study on the effects of additional mass on the board and rigidity of the board on drop test reliability. This paper examines the drop impact dynamic responses of the JEDEC JESD22-B111 board. Of interest are the effects of …
Board Level Failure Analysis Of Chip Scale Package Drop Test Assemblies, Nicholas Vickers, Kyle Rauen, Andrew Farris, Jianbiao Pan
Board Level Failure Analysis Of Chip Scale Package Drop Test Assemblies, Nicholas Vickers, Kyle Rauen, Andrew Farris, Jianbiao Pan
Industrial and Manufacturing Engineering
This paper presents the failure analysis results of board level drop tests. In this study, the test vehicle was designed according to the requirements of the Joint Electron Device Engineering Council (JEDEC) drop test board. The test vehicle was assembled with 15 chip scale packages (CSPs) each having 228 daisy-chained 0.5 mm pitch solder joints using Sn-3.0 wt% Ag-0.5 wt% Cu (SAC305) lead free solder. Assemblies were drop tested using three different peak accelerations of 900 G, 1500 G, 2900 G, with 0.7 ms, 0.5 ms, and 0.3 ms pulse durations, respectively. Scanning electron microscopy (SEM) with energy dispersive spectroscopy …
The Effect Of Ultrasonic Frequency On Gold Wire Bondability And Reliability, Jianbiao Pan, Minh-Nhat Le, Cuong Van Pham
The Effect Of Ultrasonic Frequency On Gold Wire Bondability And Reliability, Jianbiao Pan, Minh-Nhat Le, Cuong Van Pham
Industrial and Manufacturing Engineering
This paper presents a systematic study on the effect of 120KHz ultrasonic frequency on the bondability and reliability of fine pitch gold wire bonding. The study was carried out on a thermosonic ball bonder that is allowed to easily switch between ultrasonic frequency of 60KHz and 120 KHz by changing the ultrasonic transducer and the ultrasonic generator. Bonding parameters were optimized through design of experiment methodology for four different cases: 25.4 μm wire at 60 kHz, 25.4 μm wire at 120 kHz, 17.8 μm wire at 60 kHz, and 17.8 μm wire at 120 kHz. The integrity of wire bonds …
Work In Progress - Enhancing Student-Learning Through State-Of-The-Art Systems Level Design And Implementation, Albert A. Liddicoat, Jianbiao Pan, James G. Harris, Dominic J. Dal Bello, Lynne A. Slivovsky
Work In Progress - Enhancing Student-Learning Through State-Of-The-Art Systems Level Design And Implementation, Albert A. Liddicoat, Jianbiao Pan, James G. Harris, Dominic J. Dal Bello, Lynne A. Slivovsky
Industrial and Manufacturing Engineering
The curriculum for undergraduate engineering programs is often partitioned into several courses that are taught in isolation followed by a single culminating senior design or capstone project experience. In the senior design class students being to synthesize the knowledge and skills that they acquired through the engineering curriculum. This paper presents lower and upper division course and curricular changes made to accommodate learning objectives that better prepare students for project-based learning. These learning experiences and skills include: systems level design, experience with state-of-the-art Computer Aided Design (CAD) tools, printed circuit board (PBC) design, design for manufacturability, electronics assembly, project management, …
Alternative Binder Carbide Tools For Machining Superalloys, Daniel J. Waldorf, Michael Stender, Scott Liu, Daniel Norgan
Alternative Binder Carbide Tools For Machining Superalloys, Daniel J. Waldorf, Michael Stender, Scott Liu, Daniel Norgan
Industrial and Manufacturing Engineering
This study examines the performance of a new class of wear-resistant but economical cutting tools produced by varying the binder composition of standard cemented carbide composites. By replacing some or all of the cobalt binder with rhenium and nickel-based superalloy, a stronger composite tool results, potentially capable of machining heat-resistant superalloys at significantly higher cutting speeds. Sample tools with alternative binder were produced and compared to standard tools bound with cobalt only. Turning experiments on Inconel 718 were run to evaluate wear resistance and tool life for several grades. The experimentation also examined the effects of varying the relative proportions …
Enhancing Student Learning Through State-Of-The-Art Systems Level Design And Implementation: The Development Of A Lower Division Learning Module, James G. Harris, Dominic Dal Bello, Jianbiao Pan, Albert Liddicoat
Enhancing Student Learning Through State-Of-The-Art Systems Level Design And Implementation: The Development Of A Lower Division Learning Module, James G. Harris, Dominic Dal Bello, Jianbiao Pan, Albert Liddicoat
Industrial and Manufacturing Engineering
The Cal Poly/Allan Hancock team is developing a learning module that will allow all lower division engineering students to design, fabricate, assemble, and test an electronic system implemented on a printed circuit board (PCB). All the services necessary to perform this laboratory experiment will be provided with low-cost vendors available on the . The learning module is being developed so that it can be integrated into the existing electrical engineering lower division courses that are required by all engineering students. The laboratory learning module will use operational amplifiers (op amp), resistors, capacitors and other common electronic components to study the …
Curricular Enhancement To Support Project-Based Learning In Computer And Electrical Engineering, Albert Liddicoat, Jianbiao Pan, James G. Harris, Lynne A. Slivovsky
Curricular Enhancement To Support Project-Based Learning In Computer And Electrical Engineering, Albert Liddicoat, Jianbiao Pan, James G. Harris, Lynne A. Slivovsky
Industrial and Manufacturing Engineering
Undergraduate computer and electrical engineering programs often partition the curriculum into several courses based on related topics taught in isolation. Students are expected to synthesize their knowledge in a senior design project. It is the authors’ experience that students often struggle during their senior design project since they have not gained the appropriate knowledge or mastered necessary skills needed to work on a significant or team-based engineering design project. Specifically, students need to be able to define system requirements, partition the design into subcomponents, design, build, test, and verify that the system requirements have been met. The authors have enhanced …
A Project-Based Electronics Manufacturing Laboratory Course For Lower-Division Engineering Students, Jianbiao Pan, Albert Liddicoat, James G. Harris, Dominic Dal Bello
A Project-Based Electronics Manufacturing Laboratory Course For Lower-Division Engineering Students, Jianbiao Pan, Albert Liddicoat, James G. Harris, Dominic Dal Bello
Industrial and Manufacturing Engineering
This paper presents a project-based laboratory course on electronics design and manufacturing. The goal of this course is to provide lower-division engineering students a hands-on experience involving actual printed circuit board (PCB) design, layout, fabrication, assembly, and testing. Through project-based learning, students not only learn technical skills in designing and manufacturing an electronic device, but also develop their project management and communication skills early in their course of study at the university. The course outline and examples of the student projects are presented in this paper as well as project evaluations and students’ feedback. This paper also presents the selection …
Techniques For Developing Large Scale Fuzzy Logic Systems, Jon C. Ervin, Sema E. Alptekin
Techniques For Developing Large Scale Fuzzy Logic Systems, Jon C. Ervin, Sema E. Alptekin
Industrial and Manufacturing Engineering
In this paper, we describe various techniques used to make Intuitionistic Fuzzy Logic Systems amenable to operating on applications with large numbers of inputs. A rule reduction technique known as Combs method is combined with an automated tuning process based on Particle Swarm Optimization. A second stage of tuning on rule weights results in improved performance and further reduction in the size of the rule-base. The entire process has been developed to operate within the Matlab software environment. The technique is tested against the Wisconsin Breast Cancer Database. The use of these tools shows great promise in significantly expanding the …
Drop Test Reliability Of Lead-Free Chip Scale Packages, Andrew Farris, Jianbiao Pan, Albert Liddicoat, Brian J. Toleno, Dan Maslyk, Dongkai Shangguan, Jasbir Bath, Dennis Willie, David A. Geiger
Drop Test Reliability Of Lead-Free Chip Scale Packages, Andrew Farris, Jianbiao Pan, Albert Liddicoat, Brian J. Toleno, Dan Maslyk, Dongkai Shangguan, Jasbir Bath, Dennis Willie, David A. Geiger
Industrial and Manufacturing Engineering
This paper presents the drop test reliability of 0.5 mm pitch lead-free chip scale packages (CSPs). Fifteen 0.5 mm pitch CSPs were assembled on a standard JEDEC drop reliability test board with Sn3.0Ag0.5Cu lead-free solder. Eight boards were edge-bonded with a UV-cured acrylic; eight boards were edge- bonded with a thermal-cured epoxy; and twelve boards were assembled without edge bonding. Half of the edge-bonded test boards were subjected to drop tests at a peak acceleration of 1500 G with a pulse duration of 0.5 ms, and the other half subjected to drop tests at a peak acceleration of 2900 G …