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Full-Text Articles in Operations Research, Systems Engineering and Industrial Engineering
Work In Progress: Outreach Assessment: Measuring Engagement, Lizabeth Schlemer, John Oliver, Katherine Chen, Sophia Rodriguez Mata, Eric Kim
Work In Progress: Outreach Assessment: Measuring Engagement, Lizabeth Schlemer, John Oliver, Katherine Chen, Sophia Rodriguez Mata, Eric Kim
Industrial and Manufacturing Engineering
The Learn By Doing Lab (LBDL) at Cal Poly, San Luis Obispo is an on-campus laboratory where 5th through 8th grade students are taught by undergraduates who may be planning a careers in teaching. The two populations - elementary students and undergraduates - are equally important in the process. Since 2008, the lab has seen over 4000 elementary and junior high students and over 100 undergrads have participated. In most outreach assessment the number of individuals participating is an important metric, but this last Spring we experimented with a more in depth measure of effectiveness. As in any learning experience …
Integrating Courses Through Project Based Learning, Lizabeth Schlemer, Sema E. Alptekin, Karen R. Bangs
Integrating Courses Through Project Based Learning, Lizabeth Schlemer, Sema E. Alptekin, Karen R. Bangs
Industrial and Manufacturing Engineering
Integrating three courses (one sophomore level, two senior level) through Project Based Learning (PBL) within the Industrial Engineering curriculum at the California Polytechnic State University, San Luis Obispo is presented. Three courses (IME 443 Facilities Planning and Design - senior level; IME 420 Simulation - senior level; and IME 223 Process Improvement Fundamentals - sophomore level) were linked by various mechanisms: Common industry projects, common students in two of the three courses; senior students having access to sophomores in their teams to carry out time consuming tasks such as time studies, and sophomores having access to seniors as team members, …
Effect Of Gold Content On The Microstructural Evolution Of Sac305 Solder Joints Under Isothermal Aging, Mike Powers, Jianbiao Pan, Julie Silk, Patrick Hyland
Effect Of Gold Content On The Microstructural Evolution Of Sac305 Solder Joints Under Isothermal Aging, Mike Powers, Jianbiao Pan, Julie Silk, Patrick Hyland
Industrial and Manufacturing Engineering
Au over Ni on Cu is a widely used printed circuit board (PCB) surface finish, under bump metallization (UBM), and component lead metallization. It is generally accepted that less than 3 wt.% Au in Sn-Pb solder joints inhibits formation of detrimental intermetallic compounds (IMC). However, the critical limit for Au content in Pb-free solder joints is not well established. Three surface-mount package platforms, one with a matte Sn surface finish and the others with Ni/Au finish, were soldered to Ni/Au-finished PCB using Sn-3.0Ag- 0.5Cu (SAC305) solder, in a realistic manufacturing setting. The assembled boards were divided into three groups: one …
The Morphology Evolution And Voiding Of Solder Joints On Qfn Central Pads With A Ni/Au Finish, Julie Silk, Jianbiao Pan, Mike Powers
The Morphology Evolution And Voiding Of Solder Joints On Qfn Central Pads With A Ni/Au Finish, Julie Silk, Jianbiao Pan, Mike Powers
Industrial and Manufacturing Engineering
In this paper, we report on a comprehensive study regarding the morphology evolution and voiding of SnAgCu solder joints on the central pad of two different packages – QFN and an Agilent package called TOPS – on PCBs with a Ni/Au surface finish. Samples were isothermally aged at the equivalent of 0, 2, 7 and 14 years service life. Representative solder joints were cross-sectioned and analyzed using scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDX) in order to investigate the evolution of the solder joint morphology as a function of Au content and isothermal aging. IMC thickness was …