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Operations Research, Systems Engineering and Industrial Engineering Commons™
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Articles 1 - 6 of 6
Full-Text Articles in Operations Research, Systems Engineering and Industrial Engineering
Drop Impact Reliability Of Edge-Bonded Lead-Free Chip Scale Packages, Andrew Farris, Jianbiao Pan, Albert Liddicoat, Michael Krist, Nicholas Vickers, Brian J. Toleno, Dan Maslyk, Dongkai Shangguan, Jasbir Bath, Dennis Willie, David A. Geiger
Drop Impact Reliability Of Edge-Bonded Lead-Free Chip Scale Packages, Andrew Farris, Jianbiao Pan, Albert Liddicoat, Michael Krist, Nicholas Vickers, Brian J. Toleno, Dan Maslyk, Dongkai Shangguan, Jasbir Bath, Dennis Willie, David A. Geiger
Industrial and Manufacturing Engineering
This paper presents the drop test reliability results for edge-bonded 0.5 mm pitch lead-free chip scale packages (CSPs) on a standard JEDEC drop reliability test board. The test boards were subjected to drop tests at several impact pulses, including a peak acceleration of 900 Gs with a pulse duration of 0.7 ms, a peak acceleration of 1500 Gs with a pulse duration of 0.5 ms, and a peak acceleration of 2900 Gs with a pulse duration of 0.3 ms. A high-speed dynamic resistance measurement system was used to monitor the failure of the solder joints. Two edge-bond materials used in …
Teaming Multi-Level Classes On Industry Projects, Lizabeth Schlemer, Jose Macedo
Teaming Multi-Level Classes On Industry Projects, Lizabeth Schlemer, Jose Macedo
Industrial and Manufacturing Engineering
For the past few years we experimented with teaming students from a sophomore-level class and a senior-level class to work on industry projects. The classes are “work design” and “facilities design.” Projects are selected to require the application of knowledge from both disciplines. In addition, the projects are selected from small local companies. The intent of this paper is to describe the benefits and difficulties associated with this methodology. While specific classes in this experience are typical of an industrial engineering curriculum, the lessons learned and benefits could translate to other disciplines.
Optimization Of Engineering Tolerance Design Using Revised Loss Functions, Jeh-Nan Pan, Jianbiao Pan
Optimization Of Engineering Tolerance Design Using Revised Loss Functions, Jeh-Nan Pan, Jianbiao Pan
Industrial and Manufacturing Engineering
Engineering tolerance design plays an important role in modern manufacturing. Both symmetric and asymmetric tolerances are common in many manufacturing processes. Recently, various revised loss functions have been proposed for overcoming the drawbacks of Taguchi's loss function. In this article, Kapur's economic tolerance design model is modified and the economic specification limits for both symmetric and asymmetric losses are established. Three different loss functions are compared in the optimal symmetric and asymmetric tolerance design: a revised Taguchi quadratic loss function, an inverted normal loss function and a revised inverted normal loss function. The relationships among the three loss functions and …
Finding And Optimising The Key Factors For The Multiple-Response Manufacturing Process, Jeh-Nan Pan, Jianbiao Pan, Chun-Yi Lee
Finding And Optimising The Key Factors For The Multiple-Response Manufacturing Process, Jeh-Nan Pan, Jianbiao Pan, Chun-Yi Lee
Industrial and Manufacturing Engineering
With the advent of modern technology, manufacturing processes became so sophisticated that a single quality characteristic cannot reflect the true product quality. Thus, it is essential to perform the key factor analysis for the manufacturing process with multiple-input (factors) and multiple-output (responses). In this paper, an integrated approach of using the desirability function in conjunction with the Mahalanobis-Taguchi-Gram Schmit (MTGS) system is proposed in order to find and optimise the key factors for a multiple-response manufacturing process. The aim of using the MTGS method is to standardise and orthogonalise the multiple responses so that the Mahalanobis distance for each run …
Effects Of Reflow Profile And Thermal Conditioning On Intermetallic Compound Thickness For Snagcu Soldered Joints, Jianbiao Pan, Tzu-Chien Chou, Jasbir Bath, Dennis Willie, Brian J. Toleno
Effects Of Reflow Profile And Thermal Conditioning On Intermetallic Compound Thickness For Snagcu Soldered Joints, Jianbiao Pan, Tzu-Chien Chou, Jasbir Bath, Dennis Willie, Brian J. Toleno
Industrial and Manufacturing Engineering
Purpose – The purpose of this paper is to investigate the effects of reflow time, reflow peak temperature, thermal shock and thermal aging on the intermetallic compound (IMC) thickness for Sn3.0Ag0.5Cu (SAC305) soldered joints.
Design/methodology/approach – A four-factor factorial design with three replications is selected in the experiment. The input variables are the peak temperature, the duration of time above solder liquidus temperature (TAL), solder alloy and thermal shock. The peak temperature has three levels, 12, 22 and 32°C above solder liquidus temperatures (or 230, 240 and 250°C for SAC305 and 195, 205, and 215°C for SnPb). The TAL has …
The Effect Of Ultrasonic Frequency On Gold Wire Bondability And Reliability, Jianbiao Pan, Minh-Nhat Le, Cuong Van Pham
The Effect Of Ultrasonic Frequency On Gold Wire Bondability And Reliability, Jianbiao Pan, Minh-Nhat Le, Cuong Van Pham
Industrial and Manufacturing Engineering
This paper presents a systematic study on the effect of 120 KHz ultrasonic frequency on the bondability and reliability of fine pitch gold wire bonding to pads over an organic substrate with gold metallizations. The study was carried out on a thermosonic ball bonder that is allowed to easily switch between ultrasonic frequencies of 60 KHz and 120 KHz by changing the ultrasonic transducer and the ultrasonic generator. Bonding parameters were optimized through the design of experimental methodology for four different cases: 25.4 mm wire at 60 kHz, 25.4 mm wire at 120 kHz, 17.8 mm wire at 60 kHz, …