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Full-Text Articles in Operations Research, Systems Engineering and Industrial Engineering

Statistical Reliability Of Wind Power Scenarios And Stochastic Unit Commitment Cost, Didem Sari, Sarah M. Ryan Nov 2018

Statistical Reliability Of Wind Power Scenarios And Stochastic Unit Commitment Cost, Didem Sari, Sarah M. Ryan

Industrial and Manufacturing Systems Engineering Publications

Probabilistic wind power scenarios constitute a crucial input for stochastic day-ahead unit commitment in power systems with deep penetration of wind generation. To minimize the cost of implemented solutions, the scenario time series of wind power amounts available should accurately represent the stochastic process for available wind power as it is estimated on the day ahead. The high computational demands of stochastic programming motivate a search for ways to evaluate scenarios without extensively simulating the stochastic unit commitment procedure. The statistical reliability of wind power scenario sets can be assessed by approaches extended from ensemble forecast verification. We examine the ...


The Effect Of Ultrasonic Frequency On Gold Wire Bondability And Reliability, Jianbiao Pan, Minh-Nhat Le, Cuong Van Pham Jan 2009

The Effect Of Ultrasonic Frequency On Gold Wire Bondability And Reliability, Jianbiao Pan, Minh-Nhat Le, Cuong Van Pham

Industrial and Manufacturing Engineering

This paper presents a systematic study on the effect of 120 KHz ultrasonic frequency on the bondability and reliability of fine pitch gold wire bonding to pads over an organic substrate with gold metallizations. The study was carried out on a thermosonic ball bonder that is allowed to easily switch between ultrasonic frequencies of 60 KHz and 120 KHz by changing the ultrasonic transducer and the ultrasonic generator. Bonding parameters were optimized through the design of experimental methodology for four different cases: 25.4 mm wire at 60 kHz, 25.4 mm wire at 120 kHz, 17.8 mm wire ...


Drop Impact Dynamic Response Study Of Jedec Jesd22-B111 Test Board, Michael Krist, Jianbiao Pan, Andrew Farris, Nicolas Vickers Nov 2008

Drop Impact Dynamic Response Study Of Jedec Jesd22-B111 Test Board, Michael Krist, Jianbiao Pan, Andrew Farris, Nicolas Vickers

Industrial and Manufacturing Engineering

Mobile and handheld electronic devices are prone to being dropped. This drop event may result in failure of solder joints inside these devices. The need for RoHS compliant boards coupled with the demand for reliable electronics has resulted in the development of the JEDEC Standard JESD22-B111 to standardize the method of drop testing surface mount electronic components. However, there has been little study on the effects of additional mass on the board and rigidity of the board on drop test reliability. This paper examines the drop impact dynamic responses of the JEDEC JESD22-B111 board. Of interest are the effects of ...


The Effect Of Ultrasonic Frequency On Gold Wire Bondability And Reliability, Jianbiao Pan, Minh-Nhat Le, Cuong Van Pham Nov 2008

The Effect Of Ultrasonic Frequency On Gold Wire Bondability And Reliability, Jianbiao Pan, Minh-Nhat Le, Cuong Van Pham

Industrial and Manufacturing Engineering

This paper presents a systematic study on the effect of 120KHz ultrasonic frequency on the bondability and reliability of fine pitch gold wire bonding. The study was carried out on a thermosonic ball bonder that is allowed to easily switch between ultrasonic frequency of 60KHz and 120 KHz by changing the ultrasonic transducer and the ultrasonic generator. Bonding parameters were optimized through design of experiment methodology for four different cases: 25.4 μm wire at 60 kHz, 25.4 μm wire at 120 kHz, 17.8 μm wire at 60 kHz, and 17.8 μm wire at 120 kHz. The ...


Lead-Free Solder Joint Reliability – State Of The Art And Perspectives, Jianbiao Pan, Jyhwen Wang, David M. Shaddock Jan 2005

Lead-Free Solder Joint Reliability – State Of The Art And Perspectives, Jianbiao Pan, Jyhwen Wang, David M. Shaddock

Industrial and Manufacturing Engineering

There is an increasing demand for replacing tin-lead (Sn/Pb) solders with lead-free solders in the electronics industry due to health and environmental concerns. The European Union recently passed a law to ban the use of lead in electronic products. The ban will go into effect in July of 2006. The Japanese electronics industry has worked to eliminate lead from consumer electronic products for several years. Although currently there are no specific regulations banning lead in electronics devices in the United States, many companies and consortiums are working on lead-free solder initiatives including Intel, Motorola, Agilent Technologies, General Electric, Boeing ...


Lead-Free Solder Joint Reliability – State Of The Art And Perspectives, Jianbiao Pan, Jyhwen Wang, David M. Shaddock Nov 2004

Lead-Free Solder Joint Reliability – State Of The Art And Perspectives, Jianbiao Pan, Jyhwen Wang, David M. Shaddock

Industrial and Manufacturing Engineering

There is an increasing demand in replacing tin-lead (Sn/Pb) solders with lead-free solders in the electronics industry due to health and environmental concern. The European Union recently passed a law to ban the use of lead in electronic products. The ban will go into effect in July of 2006. The Japanese electronics industry has worked to eliminate lead from consumer electronic products for several years. Although currently there are no specific regulations banning lead in electronics devices in the United States, many companies and consortiums are working on lead-free solder initiatives including Intel, Motorola, Agilent Technologies, General Electric, Boeing ...