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Operations Research, Systems Engineering and Industrial Engineering Commons

Open Access. Powered by Scholars. Published by Universities.®

Mechanical Engineering

2011

Articles

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Full-Text Articles in Operations Research, Systems Engineering and Industrial Engineering

Effect Of Gold Content On The Reliability Of Snagcu Solder Joints, Jianbiao Pan, J. Silk, M. Powers, P. Hyland Oct 2011

Effect Of Gold Content On The Reliability Of Snagcu Solder Joints, Jianbiao Pan, J. Silk, M. Powers, P. Hyland

Jianbiao Pan

Electroplated Ni/Au over Cu is a popular metallization for printed circuit board finish as well as for component leads, especially wire-bondable high-frequency packages, where the gold thickness requirement for wire bonding is high. The general understanding is that less than 3 wt% of Au is acceptable in SnPb solder joints. However, little is known about the effect of Au content on the reliability of SnAgCu solder joints. The purpose of this paper is to determine the acceptable level of Au in SAC305 solder joints. Three different package platforms with different Au thicknesses were assembled on boards with two different ...