Operations Research, Systems Engineering and Industrial Engineering Commons^™

A Study Of Solder Joint Failure Criteria, Jianbiao Pan, Julie Silk

Industrial and Manufacturing Engineering

One of the challenges in an experimental study of solder joint reliability is to determine when cracks occur in a solder joint or when a solder joint fails. Cracks in a real solder joint are difficult to identify using an X-Ray system. Cross-sectioning and scanning electron microscopy (SEM) is a destructive method. A common non-destructive test method is to monitor resistance increase in a solder joint or a daisy-chain. However, no scientific research has been done in establishing the relationship between the crack area of an interconnection and the change in resistance of the interconnection. This paper proposes a method …