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Full-Text Articles in Operations Research, Systems Engineering and Industrial Engineering

A Study Of Solder Joint Failure Criteria, Jianbiao Pan, Julie Silk Oct 2011

A Study Of Solder Joint Failure Criteria, Jianbiao Pan, Julie Silk

Industrial and Manufacturing Engineering

One of the challenges in an experimental study of solder joint reliability is to determine when cracks occur in a solder joint or when a solder joint fails. Cracks in a real solder joint are difficult to identify using an X-Ray system. Cross-sectioning and scanning electron microscopy (SEM) is a destructive method. A common non-destructive test method is to monitor resistance increase in a solder joint or a daisy-chain. However, no scientific research has been done in establishing the relationship between the crack area of an interconnection and the change in resistance of the interconnection. This paper proposes a method ...


Effect Of Gold Content On The Reliability Of Snagcu Solder Joints, Jianbiao Pan, J. Silk, M. Powers, P. Hyland Oct 2011

Effect Of Gold Content On The Reliability Of Snagcu Solder Joints, Jianbiao Pan, J. Silk, M. Powers, P. Hyland

Industrial and Manufacturing Engineering

Electroplated Ni/Au over Cu is a popular metallization for printed circuit board finish as well as for component leads, especially wire-bondable high-frequency packages, where the gold thickness requirement for wire bonding is high. The general understanding is that less than 3 wt% of Au is acceptable in SnPb solder joints. However, little is known about the effect of Au content on the reliability of SnAgCu solder joints. The purpose of this paper is to determine the acceptable level of Au in SAC305 solder joints. Three different package platforms with different Au thicknesses were assembled on boards with two different ...


The Inside-Out Classroom: A Win-Win Strategy For Teaching With Technology, Daniel J. Waldorf, Lizabeth Schlemer Jun 2011

The Inside-Out Classroom: A Win-Win Strategy For Teaching With Technology, Daniel J. Waldorf, Lizabeth Schlemer

Industrial and Manufacturing Engineering

As costs of higher education soar and many universities face uncertain funding models, institutional pressures have increased to improve instructor efficiency. At the same time, U.S. industry leaders and leading educators have called for improvements in engineering education based on more interactive, hands-on student learning experiences. Although many efforts have been made to take advantage of technology to either improve student learning or to maintain student learning while increasing instructor efficiency, few approaches have been shown to improve both learning and efficiency. A teaching method is proposed to improve student learning and increase student satisfaction while also addressing the ...


Design Projects With Out-Of-Town Companies, Lizabeth Schlemer Jun 2011

Design Projects With Out-Of-Town Companies, Lizabeth Schlemer

Industrial and Manufacturing Engineering

The capstone design class in the industrial engineering department at California Polytechnic State University, San Luis Obispo (Cal Poly) includes projects with companies. The projects are large ambiguous facilities design problems that allow students to incorporate many aspects of the IE curriculum. For the past 15 years students have been participating in these projects with local companies. Over the past several years, companies from out of town (200 miles to the north in Mountain View or 200 miles to the south in Oxnard) have participated. These out of town companies have presented certain logistical issues, but they have proven to ...


Evolving A Summer Engineering Camp Through Assessment, Katherine Chen, Lizabeth Schlemer, Heather Scott Smith, Teana Fredeen Jun 2011

Evolving A Summer Engineering Camp Through Assessment, Katherine Chen, Lizabeth Schlemer, Heather Scott Smith, Teana Fredeen

Industrial and Manufacturing Engineering

EPIC (Engineering Possibilities in College) is a one-week summer program for high school students (entering 9th-12th grades) to learn about engineering and experience hands-on labs in a university atmosphere. It's an opportunity for students to explore the different types of engineering available at many universities. The aim of EPIC is to expand the College of Engineering mission to K-12 students: "To educate students for careers of service, leadership and distinction in engineering or other fields by using a participatory, learn by doing, ‘hands-on’ approach".


Effect Of Gold Content On The Reliability Of Snagcu Solder Joints, Jianbiao Pan, Julie Silk, Mike Powers, Patrick Hyland Apr 2011

Effect Of Gold Content On The Reliability Of Snagcu Solder Joints, Jianbiao Pan, Julie Silk, Mike Powers, Patrick Hyland

Industrial and Manufacturing Engineering

Electroplated Ni/Au over Cu is a popular metallization for PCB finish as well as for component leads, especially wire-bondable high frequency packages, where the gold thickness requirement for wirebonding is high. The general understanding is that less than 3 wt% of Au is acceptable in SnPb solder joints. However, little is known about the effect of Au content on the reliability of SnAgCu solder joints. The purpose of this study is to determine the acceptable level of Au in SAC305 solder joints. Three different package platforms with different Au thicknesses were assembled on boards with two different Au thicknesses ...


High-Resolution, Non-Contact Angular Measurement System For Psa/Rsa, Ronald D. Sloat Mar 2011

High-Resolution, Non-Contact Angular Measurement System For Psa/Rsa, Ronald D. Sloat

Master's Theses and Project Reports

A non-contact angular measurement system for Pitch Static Attitude (PSA) and Roll Static Attitude (RSA) of hard disk drive sliders is designed and built. Real-time sampling at over 15 KHz is achieved with accuracy of +/- 0.05 degrees over a range of approximately 2-3 degrees. Measuring the PSA and RSA is critical for hard drive manufacturers to control and improve the quality and reliability of hard drives. Although the hard drive industry is able to measure the PSA and RSA at the subassembly level at this time, there is no system available that is able to measure PSA/RSA at ...