Operations Research, Systems Engineering and Industrial Engineering Commons^™

Simtrainer: A Management Training Tool, Wade Stark, Sema E. Alptekin

Industrial and Manufacturing Engineering

Abstract published of poster paper presented at conference.

An Evaluation Of Ploughing Models For Orthogonal Machining, Daniel J. Waldorf, Richard E. Devor, Shiv G. Kapoor

Industrial and Manufacturing Engineering

An analytical comparison is made between two basic models of the flow of workpiece material around the edge of an orthogonal cutting tool during steady-state metal removal. Each has been the basis for assumptions in previous studies which attempt to model the machining process, but no direct comparison had been made to determine which, if either, is an appropriate model. One model assumes that a separation point exists on the rounded cutting edge while the other includes a stable build-up adhered to the edge and assumes a separation point at the outer extreme of the build-up. Theories of elastic-plastic deformation …

Scheduling Semiconductor Device Test Operations On Multihead Testers, Tali Freed, Robert C. Leachman

Industrial and Manufacturing Engineering

Past attempts to devise scheduling methods for the device test operations of semiconductor manufacturing firms fail to address a significant characteristic of multiple-head test systems—the dependency of processing rates on the lots processed simultaneously on the testers. Since the problem has never been modeled accurately in the scheduling literature, feasibility and performance of previously proposed scheduling methodologies for multihead testers may not be accurately assessed. In this paper, we describe the multihead tester scheduling problem, present an enumeration solution procedure, and illustrate the problems of previously suggested tester scheduling algorithms.

Gauge Repeatability & Reproducibility Study For A 3-D Solder Paste Inspection System, Jianbiao Pan, Gregory L. Tonkay, Robert H. Storer, Ronald M. Sallade, David J. Leandri

Industrial and Manufacturing Engineering

Due to the increased use of Ball Grid Arrays (BGAs) and fine pitch and ultra fine pitch Quad Flat Packages (QFPs), there is a dramatic increase in demand for solder paste inspection after the stencil printing process. The important response variables of the printing process are deposited solder paste volume, area, height and position. To identify and remove defects at the earliest possible process step, a 3-D solder paste inspection system should be used to monitor solder paste deposited on all pads on every board before component placement. An example is a fully automatic laser-based 3-D triangulation solder paste inspection …

Critical Variables Of Solder Paste Stencil Printing For Micro-Bga And Fine Pitch Qfp, Jianbiao Pan, Gregory L. Tonkay, Robert H. Storer, Ronald M. Sallade, David J. Leandri

Industrial and Manufacturing Engineering

Stencil printing continues to be the dominant method of solder deposition in high volume surface mount assembly. Control of the amount of solder paste deposited is critical for fine pitch and ultra-fine pitch SMT assembly. The process is still not well understood as indicated by the fact that industry reports 52-71% of SMT defects are related to the solder paste stencil printing process. The purpose of this paper is to identify the critical variables that influence the deposited solder paste volume, area, and height. An experiment was conducted to investigate the effects of relevant process parameters on the amount of …

Screen Printing Process Design Of Experiments For Fine Line Printing Of Thick Film Ceramic Substrates, Jianbiao Pan, Gregory L. Tonkay, Alejandro Quintero

Industrial and Manufacturing Engineering

Screen printing has been the dominant method of thick film deposition because of its low cost. Many experiments in industry have been done and many models of the printing process have been developed since the 1960's. With a growing need for denser packaging and a drive for higher pin count, screen printing has been refined to yield high resolution prints. However, fine line printing is still considered by industry to be difficult. In order to yield high resolution prints with high first pass yields and manufacturing throughput, the printing process must be controlled stringently.

This paper focuses on investigating the …

Industrial Engineering Made Simple, Deena Daggett, Sema E. Alptekin

Industrial and Manufacturing Engineering

Many high school students these days do not quickly recognize or identify Industrial Engineering (IE) procedures, practices, and products. Recruitment of qualified students into IE programs requires continuous planning, publicizing, and networking. Traditional recruitment efforts have included high school visits, brochures & flyers, and university-sponsored workshops. However, these techniques have only achieved mediocre success. Currently, a need exists for new promotional materials that utilize visual tools and provide a “hands-on” approach. We have developed several exercises that successfully introduce IE. Two such exercises are explained in this paper. The first exercise demonstrates the differences between Assembly line and Cellular Manufacturing …

Worn Tool Forces Based On Ploughing Stresses, Daniel Waldorf, Shiv G. Kapoor, Richard E. Devor

Industrial and Manufacturing Engineering

Recent work in modeling of the ploughing mechanism in basic metal machining may provide a means of estimating the additional forces to be expected when cutting with a worn tool. The results predict the rubbing stresses due to the finite radius of an unworn tool edge. Since an unworn tool can be thought of as a worn tool with a wear land width VB = 0, these stresses can make up part of a strategy for predicting the additional forces incurred by a worn tool. This paper develops a wear model by proposing a technique for utilizing the stresses predicted …