Open Access. Powered by Scholars. Published by Universities.®

Operations Research, Systems Engineering and Industrial Engineering Commons

Open Access. Powered by Scholars. Published by Universities.®

Articles 1 - 4 of 4

Full-Text Articles in Operations Research, Systems Engineering and Industrial Engineering

Investigating Cavitation Peening Parameters For Fatigue Performance Using Designed Experiment, Mohammadsadegh Mobin, Afshan Roshani, Mahmood Mobin, Ali Rastegari May 2015

Investigating Cavitation Peening Parameters For Fatigue Performance Using Designed Experiment, Mohammadsadegh Mobin, Afshan Roshani, Mahmood Mobin, Ali Rastegari

Mohammadsadegh Mobin

Mechanical surface enhancement techniques such as cavitation peening (CP) have various design parameters which can affect the fatigue performance of the part. In this study, a full factorial design of experiment is applied to investigate the effects of cavitation peening process parameters on the fatigue performance of carburized steel. These parameters include standoff distance, cavitation number, nozzle size, and exposure time. The response variables considered in this experiment include residual stress, surface roughness and austenitic ratio. Results obtained from full factorial design of experiment method were compared with the results from literature which applied Taguchi method. The comparison revealed that …


Effect Of Gold Content On The Reliability Of Snagcu Solder Joints, Jianbiao Pan, J. Silk, M. Powers, P. Hyland Oct 2011

Effect Of Gold Content On The Reliability Of Snagcu Solder Joints, Jianbiao Pan, J. Silk, M. Powers, P. Hyland

Jianbiao Pan

Electroplated Ni/Au over Cu is a popular metallization for printed circuit board finish as well as for component leads, especially wire-bondable high-frequency packages, where the gold thickness requirement for wire bonding is high. The general understanding is that less than 3 wt% of Au is acceptable in SnPb solder joints. However, little is known about the effect of Au content on the reliability of SnAgCu solder joints. The purpose of this paper is to determine the acceptable level of Au in SAC305 solder joints. Three different package platforms with different Au thicknesses were assembled on boards with two different Au …


The Dependence Of Measured Modulation Error Ratio On Phase Noise, Ron D. Katznelson Aug 2008

The Dependence Of Measured Modulation Error Ratio On Phase Noise, Ron D. Katznelson

Ron D. Katznelson

This paper reviews the algorithms used by Vector Signal Analyzers to measure Modulation Error Ratio (MER) and derives the explicit functional dependence of measured MER on phase noise of digital transmitters. The modulation error model is introduced and the analytical expression for key estimated parameters required to obtain MER measure are derived. The essential elements of algorithms employed by MER measurement instruments to estimate amplitude scale, frequency offset, and initial phase intercept and the resulting MER are identified. The frequency response of the effective phase-noise rejection filtering action associated with a given measurement epoch is derived. It is shown that …


"Minimizing Injuries Resulting From Patient Handling In Nursing Home Staff" - A Hazard Control Plan, Vikas Singh Apr 2007

"Minimizing Injuries Resulting From Patient Handling In Nursing Home Staff" - A Hazard Control Plan, Vikas Singh

Vikas Singh

A concise hazard control plan for "Minimizing Injuries Resulting from Patient Handling In Nursing Home Staff".