Nanoscience and Nanotechnology Commons^™

Mechanistic Modeling Of Nanoparticle-Stabilized Supercritical Co2 Foams And Its Implication In Field-Scale Eor Applications, Doris Patricia Ortiz Maestre

LSU Master's Theses

Previous experimental studies show that nanoparticle-stabilized supercritical CO₂ foams (or, NP CO₂ foams) can be applied as an alternative to surfactant foams, in order to reduce CO₂ mobility in gas injection enhanced oil recovery (EOR). These nanoparticles, if chosen correctly, can be an effective foam stabilizer attached at the fluid interface in a wide range of physicochemical conditions.

By using NP CO₂ foam experiments available in the literature, this study performs two tasks: (i) presenting how a mechanistic foam model can be used to fit experimental data and determine required model parameters, and (ii) investigating the …

Computational Prediction Of Conductivities Of Disk-Shaped Particulate Composites, Jian Qiu

Electronic Theses and Dissertations

The effective conductivities are determined for randomly oriented disk-shaped particles using an efficient computational algorithm based on the finite element method. The pairwise intersection criteria of disks are developed using a set of vector operations. An element partition scheme has been implemented to connect the elements on different disks across the lines of intersection. The computed conductivity is expressed as a function of the density and the size of the circular disks or elliptical plates. It is further expressed in a power-law form with the key parameters determined from curve fittings. The particle number and the trial number of simulations …

Modeling And Studying The Effect Of Texture And Elastic Anisotropy Of Copper Microstructure In Nanoscale Interconnects On Reliability In Integrated Circuits, Adarsh Basavalingappa

Legacy Theses & Dissertations (2009 - 2024)

Copper interconnects are typically polycrystalline and follow a lognormal grain size distribution. Polycrystalline copper interconnect microstructures with a lognormal grain size distribution were obtained with a Voronoi tessellation approach. The interconnect structures thus obtained were used to study grain growth mechanisms, grain boundary scattering, scattering dependent resistance of interconnects, stress evolution, vacancy migration, reliability life times, impact of orientation dependent anisotropy on various mechanisms, etc. In this work, the microstructures were used to study the impact of microstructure and elastic anisotropy of copper on thermal and electromigration induced failure.