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Full-Text Articles in Nanoscience and Nanotechnology
Alloy Solute Interactions At Grain Boundaries And Nanoscale Interfaces In Copper, Luke Prestowitz
Alloy Solute Interactions At Grain Boundaries And Nanoscale Interfaces In Copper, Luke Prestowitz
Nanoscale Science & Engineering (discontinued with class year 2014)
To study grain boundary solute interactions we have developed recipes for co-electrodeposition of dilute copper alloys including Cu(Ni) and Cu(Co). Secondary Ion Mass Spectrometry (SIMS) was used to analyze the incorporation of solute into the copper film. In addition to the co-electrodeposition process we also used a drive-in diffusion model for Au, Ag, Co, and Ni. Atomic imaging in a scanning transmission electron microscope (STEM) was used to visualize and investigate solute at grain boundaries and interfaces in polygranular copper films. By understanding these interactions and pathways of alloying solutes in copper microstructures, we can more accurately predict alloying behavior …
Organometallic Carboxylate Resists For Euv With High Sensitivity, James Passarelli
Organometallic Carboxylate Resists For Euv With High Sensitivity, James Passarelli
Nanoscale Science & Engineering (discontinued with class year 2014)
We have developed organometallic carboxylate compounds [RnM(O2CR’)2] capable of acting as negative-tone EUV resists. Overall, the best and fastest resists contain antimony, are pentavalent and the carboxylate group contains a polymerizable olefin (e.g. acrylate, methacrylate or styrenecarboxylate). Evidence suggests that high sensitivity is achieved through the polymerization of olefins in the exposed region. We have performed a systematic sensitivity study of molecules of the type RnM(O2CR’)2 where we have studied seven R groups, four main group metals (M), and three polymerizable carboxylate groups (O2CR’). We found that the greatest predictor of sensitivity of the RnSb(O2CR’)2 resists is their level of …