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Nanoscience and Nanotechnology Commons

Open Access. Powered by Scholars. Published by Universities.®

2010

University of Colorado, Boulder

Packaging

Articles 1 - 1 of 1

Full-Text Articles in Nanoscience and Nanotechnology

Atomic Layer Deposition Enabled Interconnect And Packaging Technologies For As-Grown Nanowire Devices, Jen-Hau Cheng Jan 2010

Atomic Layer Deposition Enabled Interconnect And Packaging Technologies For As-Grown Nanowire Devices, Jen-Hau Cheng

Mechanical Engineering Graduate Theses & Dissertations

Nanowires (NWs) have attracted considerable interests in many applications due to their small size, extremely high surface-to-volume ratio, and superior material properties. They are promising material candidates as fundamental building blocks for future electronic, optoelectronic, energy, sensor, and biomedical applications. The majority of research activities have focused on the synthesis of NWs. With the advent of high-performance NWs, interconnect and packaging of NWs are becoming increasingly important for device applications. Vertical NW array devices, compared with horizontal NW configurations, are of great importance for achieving ultra-high integration density at the device level without the need of additional assembly and rearrangement ...