Open Access. Powered by Scholars. Published by Universities.®

Nanoscience and Nanotechnology Commons

Open Access. Powered by Scholars. Published by Universities.®

Articles 1 - 2 of 2

Full-Text Articles in Nanoscience and Nanotechnology

Ultra-Thin Boron Nitride Films By Pulsed Laser Deposition: Plasma Diagnostics, Synthesis, And Device Transport, Nicholas Robert Glavin Apr 2016

Ultra-Thin Boron Nitride Films By Pulsed Laser Deposition: Plasma Diagnostics, Synthesis, And Device Transport, Nicholas Robert Glavin

Open Access Dissertations

This work describes, for the first time, a pulsed laser deposition (PLD) technique for growth of large area, stoichiometric ultra-thin hexagonal and amorphous boron nitride for next generation 2D material electronics. The growth of boron nitride, in this case, is driven by the high kinetic energies and chemical reactivities of the condensing species formed from physical vapor deposition (PVD) processes, which can facilitate growth over large areas and at reduced substrate temperatures. The use of optical emission spectroscopy during plasma growth provides insight into chemistry, kinetic energies, time of flight data, and spatial distributions within a PVD plasma plume ablated …


Development Of Low-Temperature Atomic Layer Deposition Of Ultra-Thin Ruco Direct Plate Liners For Flexible Electronics Applications, Dillon Alexander Gregory Jan 2016

Development Of Low-Temperature Atomic Layer Deposition Of Ultra-Thin Ruco Direct Plate Liners For Flexible Electronics Applications, Dillon Alexander Gregory

Legacy Theses & Dissertations (2009 - 2024)

Low temperature plasma-assisted atomic layer deposition-grown metal nanocomposite layers based on mixtures of ruthenium and cobalt have been investigated as potential copper adhesion/barrier layers in flexible electronics applications. The success of adapting this process to flexible electronics depends on the candidate barriers meeting several necessary properties including sufficient electrical conductivity, compatibility with Cu electroplating, and ability to prevent Cu diffusion into the substrate. Preliminary testing has shown that atomic layer deposition (ALD) can be used as a technique for depositing alloyed metallic barrier layers at the lower thermal constraints dictated by the use of polymer substrates and still produce continuous …