Nanoscience and Nanotechnology Commons^™

Femtosecond Laser Micromachining Of Low-Temperature Co-Fired Ceramic And Glass Fiber Reinforced Polymer Printed Circuit Boards Materials, Raif Farkouh

Department of Electrical and Computer Engineering: Dissertations, Theses, and Student Research

Low-temperature co-fired ceramic (LTCC), and glass fiber reinforced polymer (GFRP) printed circuit boards (PCBs) are two materials used for the packaging of electronics. The excellent mechanical and electrical properties of LTCC, combined with the ability to embed passive components offer superior radio frequency (RF) performance and device miniaturization for high-frequency applications. Due to its unique properties, LTCC provides superior performance in applications as diverse as military radar, imaging systems, advanced automotive sensing, telecommunications, and satellites. The use of LTCC in these applications has created a demand for the micromachining of holes, channels, and cavities with specific geometries and structures. Likewise, …