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Full-Text Articles in Mechanical Engineering
Autonomous Material Refill For Swarm 3d Printing, William C. Jones
Autonomous Material Refill For Swarm 3d Printing, William C. Jones
Mechanical Engineering Undergraduate Honors Theses
3D printing currently offers robust and cheap rapid prototyping solutions. While standard 3D printing remains at the periphery of mass production, the technology serves as a starting point for the development of swarm manufacturing. Since swarm manufacturing is predicated upon autonomy, swarm technology companies such as AMBOTS are seeking to minimize human involvement in the swarm’s functions. At present, the 3D printing swarm consists of the printers, a transporter which can take them between job sites, and the floor tiles which provide power and support the build surfaces. To add to this ecosystem, this project is focused on the design …
Design, Fabrication, And Reliability Effects Of Additively Manufactured First Level Compliant Interconnects For Microelectronics Application, Tumininu David Olatunji
Design, Fabrication, And Reliability Effects Of Additively Manufactured First Level Compliant Interconnects For Microelectronics Application, Tumininu David Olatunji
Graduate Theses and Dissertations
Semiconductor packaging and development is greatly dependent on the magnitude of interconnect and on-chip stress that ultimately limits the reliability of electronic components. Thermomechanical related strains occur because of the coefficient of thermal expansion mismatch from different conjoined materials being assembled to manufacture a device. To curb the effect of thermal expansion mismatch between conjoined parts, studies have been done in integrating compliant structures between dies, solder balls, and substrates. Initial studies have enabled the design and manufacturing of these structures using a photolithography approach which involves a high number of fabrication steps depending on the complexity of the structures …
The Effect Of Process Parameters And Surface Condition On Bond Strength Between Additively Manufactured Components And Polymer Substrates, Bharat Bhushan Chivukula
The Effect Of Process Parameters And Surface Condition On Bond Strength Between Additively Manufactured Components And Polymer Substrates, Bharat Bhushan Chivukula
Graduate Theses and Dissertations
Additive patching is a process in which printers with multiple axes deposit molten material onto a pre-defined surface to form a bond. Studying the effect of surface roughness and process parameters selected for printing auxiliary part on the bond helps in improving the strength of the final component. Particularly, the influence of surface roughness, as established by adhesion theory, has not been evaluated in the framework of additive manufacturing (AM). A full factorial design of experiments with five replications was conducted on two levels and three factors, viz., layer thickness, surface roughness, and raster angle to examine the underlying effects …