Mechanical Engineering Commons^™

A Study Of Microwave Curing Of Underfill Using Open And Closed Microwave Ovens, Aditya Thakare

Dissertations and Theses

As the demand for microprocessors is increasing with more and more consumers using integrated circuits in their daily life, the demand on the industry is increasing to ramp up production.

In order to speed up the manufacturing processes, new and novel approaches are trying to change certain aspects of it. Microwaves have been tried as an alternative to conventional ovens in the curing of the polymers used as underfills and encapsulants in integrated circuits packages. Microwaves however being electromagnetic waves have non uniform energy distribution in different settings, causing burning or incomplete cure of polymers.

In this study, we compare …